Please visit MCHP webpage for all notifications posted after March 2021: https://www.microchip.com/product-change-notifications/#/
If you have not registered yet, please register to receive Product Notifications from MCHP at: https://www.microchip.com/en-us/support/product-change-notification?mkt_tok=OTMxLVVERS00NjQAAAF7kwQZ-I5l-rwOiCXdPTirAReuvYce_AAzWZg27SjUKodnzZKplb7xeb12adnSjUtnySvjevHkSVyQxksdkkVlEmQ2J1J3j3nIWATTpwVXXLEB
Current Quality & Reliability Reports
- Microsemi Analog Mixed Signal (AMS) Products Quality and Reliability Report
- Microsemi Communications Products Quality and Reliability Monitoring Report
- Microsemi FPGA and SoC Products Reliability Report
For most current data since August 2019, please contact Microsemi Technical Support at https://soc.microsemi.com/Portal/Default.aspx
- Microsemi CBU & DCS Q3 & Q4 2019 Reliability Monitoring and Outgoing Quality Report
Microsemi CMPG product may be stored for extended periods before use provided that storage conditions are well controlled. Evaluation of devices has shown solderability is acceptable after a period of three years from the time the tin/solder plate or solder dip was applied to the devices. Microsemi CMPG guarantees that all product which is shipped to customers within 3 years of our assembly of the devices meets our standard quality requirements. Note that the date code on the device is the date of assembly / lead finish processing. Product characterization, reliability qualification and monitoring program performed by Microsemi CMPG demonstrate that Microsemi CMPG product may be stored for extended periods before use provided that storage conditions are well controlled. Evaluation of devices has shown solderability is acceptable after a period of three years from the time the tin/solder plate or solder dip was applied to the devices.
Microsemi CMPG guarantees that all product which is shipped to customers within 3 years of our assembly of the devices meets our standard quality requirements. Note that the date code on the device is the date of assembly / lead finish processing.
Product characterization, reliability qualification and monitoring program performed by Microsemi CMPG demonstrate that no quality degradation should be observed over time if the product is used within the conditions specified within product data sheets
Non dry pack devices should be shielded from electrostatic charge and stored in conditions not exceeding 30°C/60%RH.
Moisture sensitive product (SMD's) that are supplied by Microsemi CMPG in dry packs will need to be rebaked as stated above and repackaged every twelve months unless stored in conditions not exceeding 20% RH. See "Moisture Sensitivity (as applicable to SMD's)" for more details.
No quality degradation should be observed over time if the product is used within the conditions specified within product data sheets Non dry pack devices should be shielded from electrostatic charge and stored in conditions not exceeding 30°C/60%RH. Moisture sensitive product (SMD's) that are supplied by Microsemi CMPG in dry packs will need to be rebaked as stated above and repackaged every twelve months unless stored in conditions not exceeding 20% RH. See "Moisture Sensitivity (as applicable to SMD's)" for more details.
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