All Microsemi CMPG integrated circuits are manufactured using world class methods and materials and are designed to tolerate industry standard handling and board level processing without damage. However the solder mounting of devices onto boards can cause "pop corning" of certain types of surface mount packages if they have been improperly stored or handled. This package delamination occurs as excessive moisture within the package expands as a result of the rapid thermal changes experienced during solder mount operations. Adherence to proper storage and handling methods as described below will eliminate this risk. See "Soldering Profiles" for more details on soldering requirements.
Dry Packing
It is important that the moisture content of Surface Mount Devices (SMDs) is controlled in order to eliminate the possibility of this "popcorn" effect occurring during board solder processing. Microsemi CMPG addresses this issue by baking (where applicable) all moisture sensitive SMDs (those rated level 3) to remove any moisture and then sealing under vacuum into industry standard dry packs containing a desiccant. These dry packs also provide electrostatic protection during shipping and storage.
Floor Life
Floor life is the time allowed between opening any dry pack and subsequent soldering operations and is defined for packages according to the standard JEDEC J-STD-020. Recommended floor life for Microsemi CMPG dry packed products is indicated on the dry pack. Note that the safe floor life will be affected by the ambient environmental conditions.
Recommended floor life conditions are:
JEDEC level | Dry packed | Floor life at 30°C/60%RH |
1 | no | Unlimited |
3 | yes | 168 Hours |
A rebake is recommended if storage conditions exceed either 30°C/60% or the quoted floor life. The time and temperature of the bake depend on the package thickness as defined in the table below.
The floor life clock is reset to zero following the rebake. However if the ambient conditions still do not meet those defined the product should be used immediately following the bake.
Package Thickness |
Default Baking Times | Baking Times for Trays with <150°C Tolerance |
|
Bake @ 125°C | Bake @ 150°C | Bake @ 140°C | |
<=1.4 mm | 16 h. | 8 h. | 9 h. |
<=2.0 mm | 24 h. | 12 h. | 14 h. |
<=4.0 mm | 48 h. | 24 h. | 28 h. |
N.B. Product may be stored indefinitely once the dry pack is opened provided that the ambient humidity does not exceed 20% RH. Humidity controlled dry-air or dry-nitrogen cabinets are recommended for this purpose.
Reliability Assessment
The moisture sensitivity of all SMD families is assessed as part of Microsemi CMPG package qualifications. Devices are also preconditioned prior to certain stress tests carried out as part of our routine reliability monitoring programs. These provide us with confidence in the reliability of shipped product. Preconditioning conditions are chosen to simulate the worst case storage and soldering conditions experienced in use with exact conditions dependent upon the moisture sensitivity classification (as per JEDEC J-STD-020 & JESD22-A113). Preconditioning is applied as per JESD22-A113 prior to most stress tests, which include temperature cycling, biased damp heat and autoclave.
Typically, for dry packed SMDs (level 3) the preconditioning sequence includes a soak at 30°C/60%RH with a duration of 192 hours.
For SMDs which are not dry packed (level 1), the preconditioning sequence includes a soak at 85°C/85% RH for 168 hours.
Products Using Pb-Free Process
Pkg. Thickness <1.6 mm | 260°C |
Pkg. Thickness 1.6-2.5 mm and Volume <350 mm3 | 260°C |
Pkg. Thickness 1.6-2.5 mm and Volume 350-2000 mm3 | 250°C |
Pkg. Thickness 1.6-2.5 mm and Volume >2000 mm3 | 245°C |
Pkg. Thickness >2.5 mm and Volume <350 mm3 | 250°C |
Pkg. Thickness >2.5 mm and Volume ≥350 mm3 | 245°C |
Products Using SnPb Eutectic Process (limited availability)
Pkg. Thickness <2.5 mm | 220°C |
Pkg. Thickness <2.5 mm and Volume <350 mm3 | 235°C |
Pkg. Thickness <2.5 mm and Volume ≥350 mm3 | 220°C |
The graphical image and corresponding table below show the typical soldering profile conditions used for Microsemi CMPG devices based on assembly materials and type.
Profile
Profile Feature | Sn-Pb Eutectic Assembly | Pb-Free Assembly |
Preheat | ||
Temperature Min (Tsmin) | 100°C | 150°C |
Temperature Max (Tsmax) | 150°C | 200°C |
Time (min to max) (ts) | 60-120 seconds | 60-120 seconds |
Tsmax to Tp | ||
- Ramp-up Rate | 3°C/second max. | 3°C/second max. |
Time maintained above: | ||
- Temperature (TL) | 183°C | 217°C |
- Time (tL) | 60-150 seconds | 60-150 seconds |
Peak package body temperature (Tp) | Refer to previous table | Refer to previous table |
Time (tp) within 5°C of classification temperature (Tc) | 20 seconds | 30 seconds |
Ramp-down Rate (Tp to Tsmax) | 6°C / second max. | 6°C / second max. |
Time 25°C to Peak Temperature | 6 minutes max. | 8 minutes max. |
Notes
1. | All temperatures refer to topside of the package, measured on the package body surface. | |||
2. | These reflow profiles are for classification/preconditioning and are not meant to specify board assembly profiles | |||
3. | SMD packages previously classified to a given moisture sensitivity level by using previous revisions of J-STD-020 do not require reclassification unless a change in level or peak temperature is desired. |
Microsemi Corporation is a leading manufacturer and marketer of discrete semiconductors. Microsemi serves the automotive, computer, telecommunications, medical, industrial, space and military markets.
Committed to managing its business in an environmentally responsible manner, it will make a continual effort to prevent negative effects upon the environment and ensure the health, safety and welfare of its employees.
Microsemi Environmental Goals and Objectives
- Conduct operations in a manner that protects the environment, employees and community.
- Continually reducing environmental risks throughout its operations by identifying and measuring environmental risks and by setting performance standards, which are commensurate with best practices.
- Minimize the use of hazardous chemicals and reduce hazardous waste generation whenever feasible.
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- Provide EHS training and instruction at all levels to motivate and to ensure that proper procedures are followed.
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Microsemi management is committed to supporting environmental protection (air, water and land) and employee health and safety.
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The Microsemi Analog Mixed Signal Purchase Requisition or Purchase Order may list Quality Clauses which must be observed by a supplier. The requirements for each Quality Clause are explained in Form 8827, Purchase Order Quality Requirements. Form 8827 refers to three other documents which are listed below.
Form 8827, Purchase Order Quality Requirements (266.99 kB)
Form 9914, Major Change Categories (51.44 kB)
SGA7204, Control Policy, Banned and Restricted Substances (881.35 kB)
SGQ1327, Supplier Requirements, Banned and Restricted Substances (156.54 kB)
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