Module & Hybrid Design Services
Overview
Microsemi has a history of custom Hybrid design and manufacturing, with over 30 years of custom capabilities With experience in Defense, Aerospace, Space and Industrial applications.
Module & Hyrbid Design Services Offered
- Design and manufacture of products per requirements
- Build to print Hybrid assembly services
- Custom packaging or modified characterizations to standard products
Microsemi offers a complete line of "standard" space-grade hybrids all submitted to DLA approval
- Point of Loads (POL)
- Solid State Relays
- Linear Low Drop Out Regulators
Microsemi In-House Qualified Process & Materials
- Thick Film Substrates
- Conductive silver epoxy die attach
- Non conductive epoxy die attach
- Non conductive sheet epoxy substrate attach
- SnPb element die attach
- AuSn substrate element attach
- InPb die attach to Au plated DBC-BeO
- AuSn element attach die to DBC-BeO
- Furnace reflow AuSn die attach to BeO-DBC
- AuSn element attach to thin film Au plated BeO
- 1.0 & 2.0 mil gold thermosonic bond
- 10 mil Al ultrasonic bond
- Parallel Seam Seal, lid
Microsemi consistently meet the challenges presented for high quality hybrid products
- AS9100 Certified
- MIL PRF 38534 (Class H & K) Certified
- Class 100K clean room (Upgrading to Class 10K)
- Test and Environmental Screening
- Rack& Stack Test Systems
- Testing Over Full Temperature Range
- VLSI Digital Testing
- Power Semiconductor Testing
- Element Evaluation
- MIL-STD-883 (conformance)
- Temperature Cycle
- Constant Acceleration
- Burn-in& Life Test
- Leak Test
