FPGA & SoC RMA / Failure Analysis
Overview
Return Material Authorization (RMA) Procedures
|
UG0795: RMA Procedures for FPGA Failures User Guide |
11/2019 |
|
UG0817: Programming and Functional Failure Guidelines User Guide |
03/2018 |
|
Customer Complaint Information Request Checklist CCAR |
12/2018 |
|
Return Material Authorization (RMA) Form |
N/A |
Failure Analysis Procedures
Microsemi provides a number of resources for FPGA & SoC debug and failure analysis, shown below.
| Functional Failure Analysis Service for Flash FPGAs Description of Microsemi's Functional Failure Analysis procedure for Flash FPGAs |
11/2004 |
| Functional Failure Analysis Service for Antifuse FPGAs Description of Microsemi's Functional Failure Analysis procedure for Antifuse FPGAs |
06/2004 |
Failure Analysis Documents
| UG0817: Programming and Functional Failure Guidelines User Guide | 3/2018 |
| ICG Customer Complaint Information Request Checklist CCAR Please complete this Failure Analysis checklist and submit it to Microsemi SoC Technical Support to initiate a Customer Support Case. This checklist replaces individual checklist for programming, functional and visual mechanical failures. |
9/2015 |
| Guidelines and Procedures for Shipping Devices to Microsemi for Failure Analysis These shipping instructions should be used only after Microsemi has approved device returns for failure analysis |
4/2015 |
| AC189: Test Vector Guidelines App Note Guidelines for generating test vectors for FPGA designs
|
9/2003 |
| AC197: Device Removal Instructions for Failure Analysis App Note Instructions for cleanly removing devices from the PCB |
5/2014 |
| AC276: Board Level Considerations for Microsemi FPGAs App Note Board level recommendations for Microsemi FPGAs |
8/2012 |
