Soldering Profiles
Products Using Pb-Free Process
Pkg. Thickness <1.6 mm | 260°C |
Pkg. Thickness 1.6-2.5 mm and Volume <350 mm3 | 260°C |
Pkg. Thickness 1.6-2.5 mm and Volume 350-2000 mm3 | 250°C |
Pkg. Thickness 1.6-2.5 mm and Volume >2000 mm3 | 245°C |
Pkg. Thickness >2.5 mm and Volume <350 mm3 | 250°C |
Pkg. Thickness >2.5 mm and Volume ≥350 mm3 | 245°C |
Products Using SnPb Eutectic Process (limited availability)
Pkg. Thickness <2.5 mm | 220°C |
Pkg. Thickness <2.5 mm and Volume <350 mm3 | 235°C |
Pkg. Thickness <2.5 mm and Volume ≥350 mm3 | 220°C |
The graphical image and corresponding table below show the typical soldering profile conditions used for Microsemi CMPG devices based on assembly materials and type.
Profile
Profile Feature | Sn-Pb Eutectic Assembly | Pb-Free Assembly |
Preheat | ||
Temperature Min (Tsmin) | 100°C | 150°C |
Temperature Max (Tsmax) | 150°C | 200°C |
Time (min to max) (ts) | 60-120 seconds | 60-120 seconds |
Tsmax to Tp | ||
- Ramp-up Rate | 3°C/second max. | 3°C/second max. |
Time maintained above: | ||
- Temperature (TL) | 183°C | 217°C |
- Time (tL) | 60-150 seconds | 60-150 seconds |
Peak package body temperature (Tp) | Refer to previous table | Refer to previous table |
Time (tp) within 5°C of classification temperature (Tc) | 20 seconds | 30 seconds |
Ramp-down Rate (Tp to Tsmax) | 6°C / second max. | 6°C / second max. |
Time 25°C to Peak Temperature | 6 minutes max. | 8 minutes max. |
Notes
1. | All temperatures refer to topside of the package, measured on the package body surface. | |||
2. | These reflow profiles are for classification/preconditioning and are not meant to specify board assembly profiles | |||
3. | SMD packages previously classified to a given moisture sensitivity level by using previous revisions of J-STD-020 do not require reclassification unless a change in level or peak temperature is desired. |