WinPath3
Overview
Next Generation Access Processing
WinPath3 along with its enhanced carrier-grade software extends the proven Microsemi product formula of complete protocol solutions to a significantly higher level of performance.
WinPath3 integrates control plane and enhanced data plane processing components. Control plane processing is based on two high performance MIPS 34K multi-threaded processors.
Data plane processing uses new hardware accelerators for packet classification, hierarchical shaping, additional security standards and more which have been added to off-load common processing tasks. These accelerators are flexibly combined with Microsemi's field-proven, fully-programmable, high performance, multi-threaded WinComm multi-core data path processor subsystem. The available number of cores in WinComm has increased from six to twelve along with increases in operating speed.
This third generation of WinPath products builds upon hundreds of successful customer communications system deployments and leverages the broad set of supplied protocols developed for WinPath1 and WinPath2. These protocols include support for L2 and L3 termination (including Ethernet, ML-PPP, IMA, CES), PWE3 (for Ethernet, TDM, HDLC, ATM), Packet Network Synchronization (IEEE 1588v2, Synchronous Ethernet, adaptive and differential clock recovery), interworking (MPLS, IPv4/IPv6 Routing, VLAN-aware bridging), OAM (for Ethernet and ATM), QoS (policing, shaping, per-flow queuing, WRED) and many others.
Microsemi supplies these production hardened protocols with the silicon, with no NRE or royalties.
LTE Access and Transport protocols and WiMAX, which generally require significant OEM and deployment customization, are fully supported by royalty-free source licensing.
Interfaces have been enhanced with on-chip SERDES and the latest memory interfaces for lowered bill-of-materials costs and straightforward system integration.
WinPath3 has been designed for a straightforward upgrade of WinPath2 applications while providing significant capabilities for the next generation of access systems. Building on a base of existing applications yields a minimum of design risk, short time-to-market and lowered cost for new or migrated systems.
Key Features
- Third generation family of communication processors provided with carrier-class IP protocol and interworking software
- 5x the performance and higher integration than second generation WinPath2 family
- Extensive set of interfaces support IP up to 10 GbE and TDM/SDH up to OC 48 unchannelized or OC 24 channelized
- System bus interfaces including PCIe and dual SRIO
- 14 integrated SERDES
- Highly flexible integrated DDR and Flash memory controllers
- Powerful multi-threaded, multi-core acceleration with RAM-based code store supports evolving standards in Wireline (Carrier Ethernet, Enterprise Access, Mobile Backhaul, GPON, DSLAM) and Wireless (LTE, WiMAX, Fixed Wireless Access) systems
- Data path software is royalty-free and carrier-class supported with a C-language API for rapid system integration for over 60 protocols.
- Available data path software supports networking at Layer 2 and above, interworking, QoS, and protocols such as MPLS, MPLS-TP, PB, PBB, EFM G.Bond, PWE3-SATOP, Link Aggregation, GRE, WRED, WFQ, VLAN-aware bridging and many others
- Customer-specific requirements supported by rich suite of development tools and licensing options for source code and / or contracting both Microsemi and third-party developers
RISC Control Processors
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Data Path Processors
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New Hardware Accelerators
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Bus and Memory Interfaces
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WinComm Serial Interfaces:
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Three UPI supporting:
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16 TDI supporting T1/E1/T3/E3 or CT/MVIP bus
14 multi-standard SERDES lanes
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Host Serial Interfaces:
- UART, I2C, RMII Management Ethernet Port
Physical:
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Reference Boards

System Software
