Discretes
Documents
Document Name | Size | Published | Modified | |
---|---|---|---|---|
PCN 2013-002: Notification Part Number change for Plastic Diodes supplied to HiRel Customers
The following TVS parts have changed from Commercial to Hirel.
Please add M prefix to the following parts LCExx, P4KExx, P6KExx, SACxx, SMBJSACxx, SMCxLCExx |
1.11 MB | 04/24/2014 | 05/01/2014 | |
PCN 2013-005: Notification Assembly Process Improvements for Powermite line. Products effected 1PMT
Initial Notification Assembly Process Improvements for Powermite line. Products effected 1PMT4xxx, UPPxxx, UPSxxx, UPRxxx, UPTxxx
|
808.18 kB | 05/01/2014 | 10/17/2017 | |
PCN 2013-006: Notification Re-introducing CuMo as an alternate material for PLAD Base
This correspondence is official notification that from Date Code 1340 Microsemi will be re-introducing Copper-Molybdenum (CuMo) as an alternate material for the base plate
|
92.55 kB | 05/22/2014 | 05/22/2014 | |
PCN 2013-007: Notification Change of Assembly Location PDIP
This notification is to announce Microsemi is approving a second source assembly partner for the manufacture of the PDIP diode array devices.
This assembly partner is an existing supplier of Microsemi SOIC components and is located in Malaysia. |
261.05 kB | 04/23/2014 | 05/01/2014 | |
PCN 2013-008: Notification Change of Assembly Location SOT-143 This notification is to announce that Microsemi has approved a second source assembly partner for the SOT-143 TVS array devices.
|
263.19 kB | 04/23/2014 | 05/01/2014 | |
PCN 2013-009: Notification Datasheet amendment for UPS840(e3) product
Datasheet amendment for UPS840(e3) product
|
262.61 kB | 04/03/2014 | 05/01/2014 | |
PCN 2014-001: Notification Add M prefix to Non Hermetic TVS Surface Mount SMBxx and SMCxx SnPb Parts Description of change: Add M prefix to Non Hermetic TVS Surface Mount components supplied in SMBG (DO-215AA), SMBJ (DO-214AA)SMCG (DO-215AB) & SMCJ (DO-214AB) packages in SnPb finish. These will be offered as Hi-Rel Non-Hermetic devices. |
1.03 MB | 04/23/2014 | 10/17/2017 | |
PCN 2016-007: Expansion of Assembly to the Philippines
Expansion of Assembly to the Philippines
|
77.24 kB | 09/05/2016 | 10/17/2017 | |
PCN 2016-008: Assembly Transfer SOT-143 Package | 272.32 kB | 06/16/2016 | 10/17/2017 | |
PCN 2016-010 Initial Product/Process Change Notification
Microsemi DPG PDM Non Hermetic Product Supply Chain Update
|
100.84 kB | 09/30/2016 | 10/17/2017 | |
PCN 2016-012-1 Change of Wafer Fabrication Location for Power Schottky Die Source | 464.45 kB | 11/07/2017 | 11/07/2017 | |
PCN 2016-012: Change of Wafer Fabrication location for Power Schottky Die Source
Change of Wafer Fabrication location for Power Schottky Die Source
Description of Change: Microsemi Garden Grove Wafer Fabrication site is ceasing the Schottky die process. This silicon based die is used in the part number listing below. As a result of the cessation, Microsemi DPG will qualify select Schottky die processes in another internal Microsemi location. |
309.16 kB | 09/07/2016 | 10/17/2017 | |
PCN 2016-013: Change of die in parts UPS840e3/TR13 & UPS840/TR13 The correspondence is an official notification to inform customers about the change of die in parts |
276.33 kB | 09/13/2016 | 10/17/2017 | |
PCN 2016-014: Initial Product/Process Change Notification Assembly Transfer of Powermite™ Line |
1.51 MB | 10/25/2016 | 10/17/2017 | |
PCN 2017-002 - Addition of second die source and device assembly of the MSMBxSAC and MSMCxLCE series TVS and their derivatives
Addition of second die source and device assembly of the MSMBxSAC and MSMCxLCE series TVS and their derivatives
MSMBJSAC5.0 thru MXLSMBJSAC75, e3. MSMCJLCE6.5A thru MXLSMCJLCE170A, e3. MSMCGLCE6.5A thru MXLSMCGLCE170A, e3. |
289.31 kB | 02/06/2017 | 02/06/2017 | |
PCN 2017-005: Change of Lead Attach Used on Rectifier and Zener Devices
Change of Lead Attach Used on Rectifier and Zener Devices
|
114.9 kB | 02/28/2017 | 10/17/2017 | |
PCN 2017-007: Change in lead frame structure for TO-220AB products
Change in lead frame structure for TO-220AB products
|
344.44 kB | 03/15/2017 | 10/17/2017 | |
PCN 2017-009-2 DPG PDM Non Hermetic Product Supply Chain Update | 194.99 kB | 04/08/2020 | 04/08/2020 | |
PCN 2017-009: Non Hermetic Product Supply Chain Update
Microsemi DPG PDM Non Hermetic Product Supply Chain Update
Description of Change: Following on from Microsemi’s iPCN 2016-010, Microsemi wishes to inform our valued customer base of the decision to close our Shanghai wafer fabrication operation, effective September 29th “2017 |
137.48 kB | 04/06/2017 | 10/17/2017 | |
PCN 2017-014 - Bill of Material Epoxy Mold Change This is a change of mold compound used in Microsemi products listed products below. There is no change to the current approved assembly facility or any other materials used to produce these products. Package outline drawing of the affected products remain un-changed. Affected products will be fully compliant to all published data sheet specifications |
322.03 kB | 05/30/2017 | 05/30/2017 |