Discretes
Documents
Document Name | Size | Published | Modified | |
---|---|---|---|---|
PCN 2013-009: Notification Datasheet amendment for UPS840(e3) product
Datasheet amendment for UPS840(e3) product
|
262.61 kB | 04/03/2014 | 05/01/2014 | |
PCN 2009-008: Notification change part number FSTxx to MBRxx
Part number family will change from FSTxxx to MBRxxx.
Datasheet specifications will remain unchanged |
29.57 kB | 04/03/2014 | 05/01/2014 | |
PCN 2009-007: Notification part number change from GS1xx to GN1xx Part number family will change from GS1xx to GN1xx |
28.93 kB | 04/03/2014 | 05/01/2014 | |
PCN 2014-001: Notification Add M prefix to Non Hermetic TVS Surface Mount SMBxx and SMCxx SnPb Parts Description of change: Add M prefix to Non Hermetic TVS Surface Mount components supplied in SMBG (DO-215AA), SMBJ (DO-214AA)SMCG (DO-215AB) & SMCJ (DO-214AB) packages in SnPb finish. These will be offered as Hi-Rel Non-Hermetic devices. |
1.03 MB | 04/23/2014 | 10/17/2017 | |
PCN 2013-008: Notification Change of Assembly Location SOT-143 This notification is to announce that Microsemi has approved a second source assembly partner for the SOT-143 TVS array devices.
|
263.19 kB | 04/23/2014 | 05/01/2014 | |
PCN 2013-007: Notification Change of Assembly Location PDIP
This notification is to announce Microsemi is approving a second source assembly partner for the manufacture of the PDIP diode array devices.
This assembly partner is an existing supplier of Microsemi SOIC components and is located in Malaysia. |
261.05 kB | 04/23/2014 | 05/01/2014 | |
PCN 2013-002: Notification Part Number change for Plastic Diodes supplied to HiRel Customers
The following TVS parts have changed from Commercial to Hirel.
Please add M prefix to the following parts LCExx, P4KExx, P6KExx, SACxx, SMBJSACxx, SMCxLCExx |
1.11 MB | 04/24/2014 | 05/01/2014 | |
PCN 2012-012: Notification Add M prefix to Non Hermetic TVS Surface Mount SMJxx SnPb Pa
Add M prefix to Non Hermetic TVS Surface Mount components supplied in SMLG and SMLJ packages in SnPb finish.
These will be offered as Hi-Rel Non-Hermetic devices by adding M prefix |
769.96 kB | 04/24/2014 | 05/01/2014 | |
PCN 2012-009: Notification Change of Assembly Location SOIC SO8, SO14, SO16, QFN143
Change location for SOIC product
|
428.23 kB | 04/30/2014 | 05/01/2014 | |
PCN 2008-003: Notification to Change UPS3540e3 part number to UPS540e3
Notification to Change UPS3540e3 part number to UPS540e3
|
24.68 kB | 04/30/2014 | 05/01/2014 | |
PCN 2009-003: Notification that PowerDi 5 package is replaced by Powermite 3 package.
Notification that PowerDi 5 package is replaced by Powermite 3 package.
|
43.35 kB | 04/30/2014 | 04/30/2014 | |
PCN 2009-004: Notification that HSMBxx being replaced by SMxx also obsolete HSMCJ55xx Notification for the following: |
34.52 kB | 04/30/2014 | 04/30/2014 | |
PCN 2010-003: Notification that 60Sxxe3 is changed to 6AxxGe3
Notification that 60Sxxe3 is changed to 6AxxGe3
|
30.06 kB | 05/01/2014 | 05/01/2014 | |
PCN 2010-001: Notification Change from Hi-Rel to Commercial with appendix 1 & Commercial definition Notification Change from Hi-Rel to Commercial with appendix 1 and Commercial definition |
244.42 kB | 05/01/2014 | 05/01/2014 | |
PCN 2010.002: Notification Change Part number 30Sxx to GP30xx
Notification Change Part number 30Sxx to GP30xx
|
29.53 kB | 05/01/2014 | 05/01/2014 | |
PCN 2012-003: Initial Notification Assembly Transfer SO8, SO14, SO16, QFN143
Initial Notification Assembly Transfer SO8, SO14, SO16, QFN143
|
419.88 kB | 05/01/2014 | 10/17/2017 | |
PCN 2013-005: Notification Assembly Process Improvements for Powermite line. Products effected 1PMT
Initial Notification Assembly Process Improvements for Powermite line. Products effected 1PMT4xxx, UPPxxx, UPSxxx, UPRxxx, UPTxxx
|
808.18 kB | 05/01/2014 | 10/17/2017 | |
PCN 2007-500: Notification Part number change from 30KPxxx to RT100KPxxx
Notification Part number change from 30KPxxx to RT100KPxxx
|
1.52 MB | 05/01/2014 | 05/01/2014 | |
PCN 2011-001: Change of subcontractor for die sourcing and device assembly of the MSMB MSMC MSML
Change of subcontractor for die sourcing and device assembly of the MSMB_MSMC_MSML part family.
|
36.9 kB | 05/01/2014 | 10/17/2017 | |
PCN 2011-005: Notification Change die source and assembly for MSMxxx TVS series | 124.89 kB | 05/01/2014 | 05/01/2014 |