Discretes
Documents
Document Name | Size | Published | Modified | |
---|---|---|---|---|
PCN 2007-500: Notification Part number change from 30KPxxx to RT100KPxxx
Notification Part number change from 30KPxxx to RT100KPxxx
|
1.52 MB | 05/01/2014 | 05/01/2014 | |
PCN 2008-003: Notification to Change UPS3540e3 part number to UPS540e3
Notification to Change UPS3540e3 part number to UPS540e3
|
24.68 kB | 04/30/2014 | 05/01/2014 | |
PCN 2009-003: Notification that PowerDi 5 package is replaced by Powermite 3 package.
Notification that PowerDi 5 package is replaced by Powermite 3 package.
|
43.35 kB | 04/30/2014 | 04/30/2014 | |
PCN 2009-004: Notification that HSMBxx being replaced by SMxx also obsolete HSMCJ55xx Notification for the following: |
34.52 kB | 04/30/2014 | 04/30/2014 | |
PCN 2009-006: Notification New die foundry for MSC Schottky die qualified for CBU
New die foundry for MSC Schottky die qualified for CBU
|
60.5 kB | 05/26/2014 | 05/26/2014 | |
PCN 2009-007: Notification part number change from GS1xx to GN1xx Part number family will change from GS1xx to GN1xx |
28.93 kB | 04/03/2014 | 05/01/2014 | |
PCN 2009-008: Notification change part number FSTxx to MBRxx
Part number family will change from FSTxxx to MBRxxx.
Datasheet specifications will remain unchanged |
29.57 kB | 04/03/2014 | 05/01/2014 | |
PCN 2010-001: Notification Change from Hi-Rel to Commercial with appendix 1 & Commercial definition Notification Change from Hi-Rel to Commercial with appendix 1 and Commercial definition |
244.42 kB | 05/01/2014 | 05/01/2014 | |
PCN 2010-002A: Notification Add M prefix to commercial product supplied as Hi-Rel level
Add M prefix to commercial product supplied as Hi-Rel level
|
44.37 kB | 05/22/2014 | 10/17/2017 | |
PCN 2010-003: Notification that 60Sxxe3 is changed to 6AxxGe3
Notification that 60Sxxe3 is changed to 6AxxGe3
|
30.06 kB | 05/01/2014 | 05/01/2014 | |
PCN 2010.002: Notification Change Part number 30Sxx to GP30xx
Notification Change Part number 30Sxx to GP30xx
|
29.53 kB | 05/01/2014 | 05/01/2014 | |
PCN 2011-001: Change of subcontractor for die sourcing and device assembly of the MSMB MSMC MSML
Change of subcontractor for die sourcing and device assembly of the MSMB_MSMC_MSML part family.
|
36.9 kB | 05/01/2014 | 10/17/2017 | |
PCN 2011-001: Notification M15KP assembly material change date code 1049
Notification M15KP assembly material change date code 1049
|
123.23 kB | 05/23/2014 | 05/23/2014 | |
PCN 2011-001: Notification. Tech Note M15KP date code 1049
Notification. Tech Note M15KP date code 1049
|
43.19 kB | 05/23/2014 | 05/23/2014 | |
PCN 2011-005: Notification Change die source and assembly for MSMxxx TVS series | 124.89 kB | 05/01/2014 | 05/01/2014 | |
PCN 2012-003: Initial Notification Assembly Transfer SO8, SO14, SO16, QFN143
Initial Notification Assembly Transfer SO8, SO14, SO16, QFN143
|
419.88 kB | 05/01/2014 | 10/17/2017 | |
PCN 2012-006: Notification. msmbg change die and assembly source Notification. msmbg change die and assembly source |
123.23 kB | 05/23/2014 | 05/23/2014 | |
PCN 2012-007: Notification. MPLAD Addition on a second die source and change of base material
MPLAD Addition on a second die source and change of base material
|
165.72 kB | 05/23/2014 | 05/23/2014 | |
PCN 2012-009: Notification Change of Assembly Location SOIC SO8, SO14, SO16, QFN143
Change location for SOIC product
|
428.23 kB | 04/30/2014 | 05/01/2014 | |
PCN 2012-012: Notification Add M prefix to Non Hermetic TVS Surface Mount SMJxx SnPb Pa
Add M prefix to Non Hermetic TVS Surface Mount components supplied in SMLG and SMLJ packages in SnPb finish.
These will be offered as Hi-Rel Non-Hermetic devices by adding M prefix |
769.96 kB | 04/24/2014 | 05/01/2014 |