Discretes
Documents
Document Name | Size | Published | Modified | |
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PCN 2017-015 - Assembly Transfer of Powermite‰ã¢ Line ‰ÛÒ Powermite 1 DO-216AA Package
Assembly Transfer of Powermite™ Line – Powermite 1 DO-216AA Package
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1.05 MB | 05/30/2017 | 05/30/2017 | |
PCN 2017-016 - Assembly Transfer of Powermite‰ã¢ Line ‰ÛÒ Powermite 3 Package | 317.39 kB | 07/13/2017 | 07/13/2017 | |
PCN 2017-020: Change of JANS serial tags
This correspondence is official notification of the change to serial tag used on JANS and JANS-equivalent DO213AA and DO213AB product due to the discontinuance of the currently used tag. The current tag is an ink imprinted thin polyester film with a solvent resistant white topcoat and an acrylic pressure sensitive adhesive. The new tag is a digital print with a protective varnish on thin polyester film with a solvent resistant white topcoat and an acrylic pressure sensitive adhesive. The digital print on the newer tag requires the introduction of a varnish layer to protect the serial numbers. The polyester film, solvent resistant topcoat and acrylic pressure sensitive adhesive remain unchanged.
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511.88 kB | 12/18/2017 | 12/19/2017 | |
PCN 2017-08-27: Diode TO-247 to True 2-Lead
Diode TO-247 package change from 3-lead with dambar to true 2-lead with 100% Sn plate lead finish
APT100DL60BG, APT30DL60BG, APT15D100BG, APT15D120BG, APT15D60BG, APT15DS60BG, APT30D100BG, APT30D120BG, APT30D20BG, APT30D30BG, APT30D40BG, APT30D60BG, APT30DS60BG, APT60D100BG, APT60D120BG, APT60D20BG, APT60D40BG, APT60D60BG, APT15DQ100BG, APT15DQ120BG, APT15DQ60BG, APT30DQ100BG, APT30DQ120BG, APT30DQ60BG, APT40DQ100BG, APT40DQ120BG, APT40DQ60BG, APT60DQ100BG, APT60DQ120BG, APT60DQ60BG, APT75DQ100BG, APT75DQ120BG, APT75DQ60BG, APT100S20BG, APT30S20BG, APT60S20BG |
525.05 kB | 10/19/2017 | 10/19/2017 | |
PCN 2017-10-16: SiC Schottky Diode Foundry Change
MSC010SDA120B, MSC010SDA120K, MSC020SDA120B, MSC030SDA120B, MSC030SDA120K, MSC050SDA120B, MSC050SDA120K
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506.35 kB | 10/19/2017 | 10/19/2017 | |
PCN 2018-007: Assembly Site Transfer of Non-Hermetic Array devices | 317.38 kB | 11/21/2018 | 11/21/2018 | |
PCN 2019-004: JANS Assembly Addition MPhil2 | 217.45 kB | 11/08/2019 | 11/08/2019 | |
PCN 2019-005: Addition of die source of various commercial devices | 198.61 kB | 12/09/2019 | 12/09/2019 | |
PCN 2020-001 Addition of second source of die of the MUPT series TVS and their derivatives | 209.76 kB | 04/08/2020 | 04/08/2020 | |
PCN 2020-003 Initial Notification of an Additional Wafer Fab Location for Discrete Products | 814.72 kB | 10/07/2020 | 10/14/2020 | |
PCN#19-011 : Silicon Diode die change on APTDF400xx170G standard products | 495.44 kB | 07/04/2019 | 07/04/2019 | |
PCN#19-054: MSC2X & APT2X Standard Part Number Changes This ECN is to notify you that part numbers are changing for our SiC Diode devices in Dual-Diode configuration and SOT-227 packages. All new part numbers are pin compatible replacements. The old part numbers will no longer be available from MICROSEMI/MICROCHIP, and the new part numbers will replace the old part numbers in the next price book edition and our upcoming catalog. Some of the older part numbers (APT2X) were previously discontinued with PDN#19-021. Associated data sheets shall be replaced on the website in a very short time as well. |
582.36 kB | 12/10/2019 | 05/13/2020 |