Discretes
Documents
Document Name | Size | Published | Modified | |
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PCN#19-054: MSC2X & APT2X Standard Part Number Changes This ECN is to notify you that part numbers are changing for our SiC Diode devices in Dual-Diode configuration and SOT-227 packages. All new part numbers are pin compatible replacements. The old part numbers will no longer be available from MICROSEMI/MICROCHIP, and the new part numbers will replace the old part numbers in the next price book edition and our upcoming catalog. Some of the older part numbers (APT2X) were previously discontinued with PDN#19-021. Associated data sheets shall be replaced on the website in a very short time as well. |
582.36 kB | 12/10/2019 | 05/13/2020 | |
PCN#19-011 : Silicon Diode die change on APTDF400xx170G standard products | 495.44 kB | 07/04/2019 | 07/04/2019 | |
PCN 2020-003 Initial Notification of an Additional Wafer Fab Location for Discrete Products | 814.72 kB | 10/07/2020 | 10/14/2020 | |
PCN 2020-001 Addition of second source of die of the MUPT series TVS and their derivatives | 209.76 kB | 04/08/2020 | 04/08/2020 | |
PCN 2019-005: Addition of die source of various commercial devices | 198.61 kB | 12/09/2019 | 12/09/2019 | |
PCN 2019-004: JANS Assembly Addition MPhil2 | 217.45 kB | 11/08/2019 | 11/08/2019 | |
PCN 2018-007: Assembly Site Transfer of Non-Hermetic Array devices | 317.38 kB | 11/21/2018 | 11/21/2018 | |
PCN 2017-10-16: SiC Schottky Diode Foundry Change
MSC010SDA120B, MSC010SDA120K, MSC020SDA120B, MSC030SDA120B, MSC030SDA120K, MSC050SDA120B, MSC050SDA120K
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506.35 kB | 10/19/2017 | 10/19/2017 | |
PCN 2017-08-27: Diode TO-247 to True 2-Lead
Diode TO-247 package change from 3-lead with dambar to true 2-lead with 100% Sn plate lead finish
APT100DL60BG, APT30DL60BG, APT15D100BG, APT15D120BG, APT15D60BG, APT15DS60BG, APT30D100BG, APT30D120BG, APT30D20BG, APT30D30BG, APT30D40BG, APT30D60BG, APT30DS60BG, APT60D100BG, APT60D120BG, APT60D20BG, APT60D40BG, APT60D60BG, APT15DQ100BG, APT15DQ120BG, APT15DQ60BG, APT30DQ100BG, APT30DQ120BG, APT30DQ60BG, APT40DQ100BG, APT40DQ120BG, APT40DQ60BG, APT60DQ100BG, APT60DQ120BG, APT60DQ60BG, APT75DQ100BG, APT75DQ120BG, APT75DQ60BG, APT100S20BG, APT30S20BG, APT60S20BG |
525.05 kB | 10/19/2017 | 10/19/2017 | |
PCN 2017-020: Change of JANS serial tags
This correspondence is official notification of the change to serial tag used on JANS and JANS-equivalent DO213AA and DO213AB product due to the discontinuance of the currently used tag. The current tag is an ink imprinted thin polyester film with a solvent resistant white topcoat and an acrylic pressure sensitive adhesive. The new tag is a digital print with a protective varnish on thin polyester film with a solvent resistant white topcoat and an acrylic pressure sensitive adhesive. The digital print on the newer tag requires the introduction of a varnish layer to protect the serial numbers. The polyester film, solvent resistant topcoat and acrylic pressure sensitive adhesive remain unchanged.
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511.88 kB | 12/18/2017 | 12/19/2017 | |
PCN 2017-016 - Assembly Transfer of Powermite‰ã¢ Line ‰ÛÒ Powermite 3 Package | 317.39 kB | 07/13/2017 | 07/13/2017 | |
PCN 2017-015 - Assembly Transfer of Powermite‰ã¢ Line ‰ÛÒ Powermite 1 DO-216AA Package
Assembly Transfer of Powermite™ Line – Powermite 1 DO-216AA Package
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1.05 MB | 05/30/2017 | 05/30/2017 | |
PCN 2017-014 - Bill of Material Epoxy Mold Change This is a change of mold compound used in Microsemi products listed products below. There is no change to the current approved assembly facility or any other materials used to produce these products. Package outline drawing of the affected products remain un-changed. Affected products will be fully compliant to all published data sheet specifications |
322.03 kB | 05/30/2017 | 05/30/2017 | |
PCN 2017-009: Non Hermetic Product Supply Chain Update
Microsemi DPG PDM Non Hermetic Product Supply Chain Update
Description of Change: Following on from Microsemi’s iPCN 2016-010, Microsemi wishes to inform our valued customer base of the decision to close our Shanghai wafer fabrication operation, effective September 29th “2017 |
137.48 kB | 04/06/2017 | 10/17/2017 | |
PCN 2017-009-2 DPG PDM Non Hermetic Product Supply Chain Update | 194.99 kB | 04/08/2020 | 04/08/2020 | |
PCN 2017-007: Change in lead frame structure for TO-220AB products
Change in lead frame structure for TO-220AB products
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344.44 kB | 03/15/2017 | 10/17/2017 | |
PCN 2017-005: Change of Lead Attach Used on Rectifier and Zener Devices
Change of Lead Attach Used on Rectifier and Zener Devices
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114.9 kB | 02/28/2017 | 10/17/2017 | |
PCN 2017-002 - Addition of second die source and device assembly of the MSMBxSAC and MSMCxLCE series TVS and their derivatives
Addition of second die source and device assembly of the MSMBxSAC and MSMCxLCE series TVS and their derivatives
MSMBJSAC5.0 thru MXLSMBJSAC75, e3. MSMCJLCE6.5A thru MXLSMCJLCE170A, e3. MSMCGLCE6.5A thru MXLSMCGLCE170A, e3. |
289.31 kB | 02/06/2017 | 02/06/2017 | |
PCN 2016-014: Initial Product/Process Change Notification Assembly Transfer of Powermite™ Line |
1.51 MB | 10/25/2016 | 10/17/2017 | |
PCN 2016-013: Change of die in parts UPS840e3/TR13 & UPS840/TR13 The correspondence is an official notification to inform customers about the change of die in parts |
276.33 kB | 09/13/2016 | 10/17/2017 |