Datasheets
Documents
Document Name | Size | Published | Modified | |
---|---|---|---|---|
UPGA301A Datasheet
UPGA301Ae3 datasheet
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287.31 kB | 11/30/-1 | 01/21/2014 | |
UPS120e3 Rev E Datasheet
UPS120e3 Data sheet
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417.62 kB | 11/30/-1 | 11/30/-1 | |
UPS120Ee3 Rev E Datasheet
UPS120Ee3 datasheet
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417.86 kB | 11/30/-1 | 11/30/-1 | |
UPS140 Datasheet
The Microsemi UPS140e3 Powermite® Schottky rectifier is RoHS compliant and offers optimized forward voltage characteristics with reverse blocking capabilities up to 40 Volt. They are ideal for surface mount applications that operate at high frequencies.
In addition to its size advantages, Powermite® package features include a full metallic bottom that eliminates possibility of solder flux entrapment during assembly, and a unique locking tab acts as an efficient heat path from die to mounting plane for external heat sinking with very low thermal resistance junction to case (bottom). Its innovative design makes this device ideal for use with automatic insertion equipment.
|
107.46 kB | 11/30/-1 | 11/30/-1 | |
UPS140e3 Rev D Datasheet
UPS140e3 datasheet
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417.41 kB | 11/30/-1 | 11/30/-1 | |
UPS160e3 Rev D Datasheet
UPS160e3 datasheet
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416.83 kB | 11/30/-1 | 11/30/-1 | |
UPS315 Datasheet | 102.9 kB | 11/30/-1 | 11/30/-1 | |
UPS340 DATA SHEET Datasheet
In Microsemi’s new Powermite3® SMT package, these high efficiency ultrafast rectifiers offer the power handing capabilities previously found only in much larger packages. They are ideal for SMD applications that operate at high frequencies. In addition to its size advantages, Powermite3® package features include a full metallic bottom that eliminates the possibility of solder flux entrapment during assembly, and a unique locking tab acts as an integral heat sink. Its innovative design makes this device ideal for use with automatic insertion equipment.
|
284.35 kB | 11/30/-1 | 11/30/-1 | |
ups3540 data sheet Datasheet
In Microsemi’s new Powermite3® SMT package, these high efficiency ultrafast rectifiers offer the power handing capabilities previously found only in much larger packages. They are ideal for SMD applications that operate at high frequencies. In addition to its size advantages, Powermite3® package features include a full metallic bottom that eliminates the possibility of solder flux entrapment during assembly, and a unique locking tab acts as an integral heat sink. Its innovative design makes this device ideal for use with automatic insertion equipment.
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369.51 kB | 11/30/-1 | 11/30/-1 | |
UPS360 Datasheet
This UPS360e3 in the Powermite3® package is a high efficiency Schottky rectifier that is also RoHS compliant offering high current/power capabilities previously found only in much larger packages. They are ideal for SMD applications that operate at high frequencies. In addition to its size advantages, the Powermite3® package includes a full metallic bottom that eliminates the possibility of solder flux entrapment during assembly and a unique locking tab act as an efficient heat path to the heat-sink mounting. Its innovative design makes this device ideal for use with automatic insertion equipment.
|
194.22 kB | 11/30/-1 | 11/30/-1 | |
UPS360 DATA SHEET Datasheet
In Microsemi’s new Powermite3® SMT package, these high efficiency ultrafast rectifiers offer the power handing capabilities previously found only in much larger packages. They are ideal for SMD applications that operate at high frequencies. In addition to its size advantages, Powermite3® package features include a full metallic bottom that eliminates the possibility of solder flux entrapment during assembly, and a unique locking tab acts as an integral heat sink. Its innovative design makes this device ideal for use with automatic insertion equipment.
|
236.87 kB | 11/30/-1 | 11/30/-1 | |
UPS5100 DATA SHEET Datasheet
In Microsemi’s new Powermite3® SMT package, these high efficiency ultrafast rectifiers offer the power handing capabilities previously found only in much larger packages. They are ideal for SMD applications that operate at high frequencies. In addition to its size advantages, Powermite3® package features include a full metallic bottom that eliminates the possibility of solder flux entrapment during assembly, and a unique locking tab acts as an integral heat sink. Its innovative design makes this device ideal for use with automatic insertion equipment.
|
227.34 kB | 11/30/-1 | 11/30/-1 | |
UPS520 Datasheet | 254.62 kB | 11/30/-1 | 11/30/-1 | |
UPS615 Datasheet | 103.36 kB | 11/30/-1 | 11/30/-1 | |
UPS6150 Datasheet
6A,150V Schottky rectifier in Powermite 3 surface mount package.
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115.47 kB | 11/30/-1 | 11/30/-1 | |
UPSC100-200 Datasheet | 191.06 kB | 11/30/-1 | 11/30/-1 | |
UPSC100-200 Datasheet
In Microsemi’s new Powermite® SMT package, these high efficiency ultrafast rectifiers offer the power handing capabilities previously found only in much larger packages. They are ideal for SMD applications that operate at high frequencies. In addition to its size advantages, Powermite® package features include a full metallic bottom that eliminates the possibility of solder flux entrapment during assembly, and a unique locking tab acts as an integral heat sink. Its innovative design makes this device ideal for use with automatic insertion equipment.
|
191.06 kB | 11/30/-1 | 11/30/-1 | |
UPSC200 Datasheet
In Microsemi’s new Powermite® SMT package, these high efficiency ultrafast rectifiers offer the power handing capabilities previously found only in much larger packages. They are ideal for SMD applications that operate at high frequencies.In addition to its size advantages, Powermite® package features include a full metallic bottom that eliminates the possibility of solder flux entrapment during assembly, and a unique locking tab acts as an integral heat sink. Its innovative design makes this device ideal for use with automatic insertion equipment.
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249.92 kB | 11/30/-1 | 11/30/-1 | |
UPSC203 Datasheet | 230.64 kB | 11/30/-1 | 11/30/-1 | |
USD3030C Datasheet
30A,30V-45V Schottky rectifier in TO247AD package
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138.04 kB | 11/30/-1 | 11/30/-1 |