
Datasheets
Documents
Document Name | Size | Published | Modified | ||
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USBQNM504 Unidirectional TVS Family Datasheet
USBQNM50403e3 - USBQNM50424e3 series
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371.68 kB | 08/07/2013 | 10/01/2015 | |
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USBQNM504 Bidirectional TVS Family Datasheet
USBQNM50403Ce3 - USBQNM50424Ce3 datasheet
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368.6 kB | 09/18/2013 | 10/01/2015 | |
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USBQ504 Unidirectional TVS Family Datasheet
USBQ50403e3 - USBQ50424e3 series datasheet
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379.24 kB | 08/28/2013 | 10/01/2015 | |
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USBQ504 Bidirectional TVS Family Datasheet
USBQ50403Ce3 - USBQ50424Ce3 series datasheet
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372.15 kB | 08/28/2013 | 10/01/2015 | |
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USB50803 ‰ÛÒ USB50824 Datasheet
USB50803 – USB50824 datasheet
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383.5 kB | 11/30/-1 | 10/01/2015 | |
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USB50403C ‰ÛÒ USB50424C series datasheet USB50403C – USB50424C series datasheet |
448.72 kB | 11/30/-1 | 08/09/2016 | |
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USB50403C ‰ÛÒ USB50424C Datasheet | 448.72 kB | 08/09/2016 | 09/27/2016 | |
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USB50403 ‰ÛÒ USB50424 unidirectional TVS Array Datasheet
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443.27 kB | 09/27/2016 | 09/27/2016 | |
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USB50403 ‰ÛÒ USB50424 Transient Voltage Suppressor (TVS) family Datasheet This USB50403 – USB50424 Transient Voltage Suppressor (TVS) family is packaged in a SOT-143 configuration giving protection to 1 unidirectional data or interface line. It is designed for use in applications where protection is required at the board level from voltage transients caused by electrostatic discharge (ESD) as defined in IEC 61000–4-2, electrical fast transients (EFT) per IEC 61000-4-4, and secondary effects of lightning. It is also available in RoHS compliant versions. These TVS arrays have a peak power rating of 500 watts for an 8/20 msec pulse. This array is suitable for protection of sensitive circuitry consisting of TTL, CMOS, DRAM’s, SRAM’s, HCMOS, HSIC microprocessors, and Universal Serial Bus (USB) and I/O transceivers |
443.27 kB | 09/27/2016 | 09/27/2016 | |
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USB50403 - USB50424 Series Datasheet Datasheet for USB50403 - USB50424 series |
443.27 kB | 11/30/-1 | 09/27/2016 | |
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UPT and UPTB TVS Family Datasheet
Datasheet for UPT5e3 – UPT48e3, UPT5Re3 – UPT48Re3, UPTB8e3 – UPTB48e3 series
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286.29 kB | 03/27/2013 | 06/07/2017 | |
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UPSC203 Datasheet | 230.64 kB | 11/30/-1 | 11/30/-1 | |
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UPSC200 Datasheet
In Microsemi’s new Powermite® SMT package, these high efficiency ultrafast rectifiers offer the power handing capabilities previously found only in much larger packages. They are ideal for SMD applications that operate at high frequencies.In addition to its size advantages, Powermite® package features include a full metallic bottom that eliminates the possibility of solder flux entrapment during assembly, and a unique locking tab acts as an integral heat sink. Its innovative design makes this device ideal for use with automatic insertion equipment.
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249.92 kB | 11/30/-1 | 11/30/-1 | |
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UPSC100-200 Datasheet | 191.06 kB | 11/30/-1 | 11/30/-1 | |
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UPSC100-200 Datasheet
In Microsemi’s new Powermite® SMT package, these high efficiency ultrafast rectifiers offer the power handing capabilities previously found only in much larger packages. They are ideal for SMD applications that operate at high frequencies. In addition to its size advantages, Powermite® package features include a full metallic bottom that eliminates the possibility of solder flux entrapment during assembly, and a unique locking tab acts as an integral heat sink. Its innovative design makes this device ideal for use with automatic insertion equipment.
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191.06 kB | 11/30/-1 | 11/30/-1 | |
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ups840 datasheet | 632.42 kB | 10/11/2016 | 10/11/2016 | |
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UPS6150 Datasheet
6A,150V Schottky rectifier in Powermite 3 surface mount package.
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115.47 kB | 11/30/-1 | 11/30/-1 | |
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UPS615 Datasheet | 103.36 kB | 11/30/-1 | 11/30/-1 | |
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UPS520 Datasheet | 254.62 kB | 11/30/-1 | 11/30/-1 | |
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UPS5100 DATA SHEET Datasheet
In Microsemi’s new Powermite3® SMT package, these high efficiency ultrafast rectifiers offer the power handing capabilities previously found only in much larger packages. They are ideal for SMD applications that operate at high frequencies. In addition to its size advantages, Powermite3® package features include a full metallic bottom that eliminates the possibility of solder flux entrapment during assembly, and a unique locking tab acts as an integral heat sink. Its innovative design makes this device ideal for use with automatic insertion equipment.
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227.34 kB | 11/30/-1 | 11/30/-1 |