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IGLOO Family Overview
The Industry's Low-Power FPGAs
The Microsemi IGLOO® series of low-power flash FPGAs includes IGLOO/e, IGLOO nano and IGLOO PLUS —the industry's low-power FPGAs. IGLOO FPGA family are designed to meet the demand of low power and small foot print requirements of today's portable and power-conscious electronics.
The IGLOO low-power FPGA family support up to 35K logic elements with up to 504 kbits of true dual-port SRAM, up to 6 embedded PLLs, and up to 620 user I/Os. Low-power applications that require 32-bit processing can use the ARM ® Cortex-M1 processor without license fee or royalties in M1 IGLOO devices.
The IGLOO FPGA family devices are available in small footprint (3x3, 4x4, 5x5, 6x6 and 8x8 mm), high
density, chip-scale and quad flat no-lead packages.
The IGLOO series includes:
|IGLOO Family||IGLOO/e||IGLOO nano||IGLOO PLUS|
|ARM - Enabled||M1 IGLOO/e|
|Overview||The low-power programmable solution||The industry's lowest-power, smallest-size solution||The low-power FPGA with more I/O per LE compared to IGLOO|
|Max User I/Os||620||71||212|
|Power Consumption||5 µW||2 µW||5 µW|
The Flash*Freeze technology used in IGLOO devices enables easy entry and exit from low power mode which consumes as little as 2 µW, while retaining SRAM and register data. Flash*Freeze technology simplifies power management through I/O and clock management without a need to turn off voltages, I/Os, or clocks at the system level.In Flash*Freeze mode, power drops to as low as 2 µW, and no additional components are required to turn off I/Os or clocks while preserving the design information, SRAM content, and registers. I/Os can maintain their state during Flash*Freeze mode. Entering and exiting Flash*Freeze mode takes less than 1 µs.
Small Footprint Packages
Microsemi IGLOO low-power FPGAs are true single-chip devices, do not require configuration or other support components, and offer a variety of small-footprint packages with high I/O pin count to match design needs.The Microsemi IGLOO family is offered in a small form factor (3x3, 4x4, 5x5, 6x6, and 8x8 mm), high-density, chip-scale packages and quad flat no-lead packages.