SiC Modules
Overview
Microsemi combines a formidable array of technologies in semiconductors, packaging and automated manufacturing to produce a wide range of high-quality modules optimized for the following traits:- Reliability
- Efficiency and electrical performance
- Low cost
- Space savings
- Reduced assembly time
Microsemi serves a broad spectrum of industrial applications for Welding, Solar, Induction Heating, Medical, UPS, Motor Control, and SMPS markets as well as High-reliability applications for Semicap, Defense, and Aerospace markets. A wide selection of construction materials enables Microsemi to manufacture with short lead times modules with the following features:
- Extended temperature range: –60 °C to 200 °C
- High reliability
- Reduced size and weight
- High-reliability testing and screening options
- Isolated gate driver
- Snubbers
- Mix-and-match semiconductors
- Short-circuit protection
- Temperature and current sensing
- Parameter binning
Microsemi NEW SP6LI (Low Inductance)
- Extremely Low Stray Inductance < 2.9 nanohenry
- Dedicated to SiC MOSFET Technology
- Enabling High Current
- High Switching Frequency
- High Efficiency
Microsemi’s SP6LI product family features five standard modules, offering phase leg topology ranking from 1200 volts (V), 210 amperes (A) to 586 A at a case temperature (Tc) of 80 degrees Celsius to 1700 V, 207 A at Tc of 80 degrees Celsius. Offering higher power density and a compact form factor, the new package enables lower quantity of modules in parallel to achieve complete systems, helping customers to further downsize their equipment.

Resources
Selection Guides
SiC Documentation
- 48kW Resonant Converter for X-ray Machines Uses High-Speed Power Modules with Integral Liquid Cooling
- Advanced IGBT Driver Application Manual
- Baseplate Flatness of Power Modules
- Handling Instructions & Protection against Electrostatic Discharges
- High-Frequency Resonant Half Bridge
- Mounting Instructions for D3 and D4 Power Modules
- Mounting Instructions for SP1 Power Modules
- Mounting Instructions for Phase Leg and Full Bridge SP2 Power Modules
- Mounting Instructions for SP3 Power Modules
- Mounting Instructions for SP3F Power Modules
- Mounting Instructions for SP4 Power Modules
- Mounting Instructions for SP6 Power Modules
- Mounting Instructions for SP6 Low Inductance Power Module
- Mounting Instruction for SP6P Power Module
- Parallel Connection of IGBT and MOSFET Power Modules
- Turn-Off Snubber Design for High-Frequency Modules
- Using NTC Temperature Sensors Integrated into Power Modules
- SiC SP3 Module Driver Reference Design
- SiC SP6LI Module Driver Reference Design