Hybrid Spiral Bias Elements
Overview
Description
The GC9000 series of spiral bias element chips are photolithographically fabricated planar spiral conductors supported on a high quality fused quartz substrate. These devices are designed to meet hybrid microwave circuit requirements for DC power injection through Ku (or J) band. The actual spiral bias element, consists of a 5 micron, nominal, thick plated gold spiral trace with a 3 mil diameter bonding pad at either end.
A dense passivation is applied on the conductive portion of the spiral geometry so that undesirable environmental or particulate effects during operation can be prevented. The bonding pads are left exposed to provide easy, low resistance lead attachment.
Fused quartz substrates are used to minimize dielectric losses, near zero TCE and provide durability during handling and assembly.
Contemporary fabrication processes combined with Microsemi Lowell’s extensive experience in microwave component and hybrid circuit engineering has generated a product that will be both operationally predictable and reliable when used as a means to supply DC to a small signal hybrid microwave circuit.
This series of devices meets RoHS requirements per EU Directive 2002/95/EC. The standard terminal finish is gold unless otherwise specified. Consult the factory if you have special requirements.
Key Features
- Dimensional Uniformity
- Planar Design
- Passive Spiral Element
- Physical and Dimensional Stability Through Temp Cycle and Vibration
- Models as a Lossy Transmission Line
- Eliminates Plotting or Coating Wire-wound Coils
- Designed for 2 to 18 GHz Applications
- Reduced Assembly Costs
- RoHS Compliant
Applications
- RF Bias Networks
- Wideband Performance
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