Rad-Tolerant FPGAs
Overview
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RTG4 FPGAs
» RTG4 FPGA |
Space System Managers are companion devices that can be used with any Radiation-Tolerant FPGAs  |
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RTAX FPGAs
» RTAX-S/SL » RTAX-DSP |
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RT ProASIC3 FPGAs
» RT ProASIC3 |
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RTSX-SU FPGAs
» RTSX-SU |
For a complete list of available space products and package offerings, read the RT FPGAs Product Catalog
Radiation & Reliability Data
Single Event Upset (SEU) and Single Event Latch-Up (SEL) Performance
Radiation Effects
Ionizing radiation can cause unwanted effects in semiconductor devices. Energetic protons, neutrons, heavy ions, and alpha particles can strike sensitive regions of the transistor, causing various failures, or Single Event Effects (SEE), such as:- Single Event Upsets (SEUs), which occur when high-energy ionizing particles, such as heavy ions, alpha particles or protons, irradiate a circuit or pass through an integrated circuit causing a disruption in the system logic.
- Single Event Latch-Up (SEL), which is a condition that causes loss of device functionality due to a single-event-induced high current state. A SEL may or may not cause permanent device damage, but requires power strobing of the device to resume normal device operations. Devices with low (< 37.5 MeV-cm2/mg) SEL LETth are considered unsuitable for space applications.
The SEU and SEL performance of Microsemi products are included in the radiation reports below. See also Conference Papers.
| RTG4 PLL and Internal Oscillator SEE Report |  |
89 KB | 11/2017 |
| Radiation-Tolerant ProASIC3 Single-Event Latch-Up Test Report | |
963 KB | 5/2017 |
| Radiation-Tolerant ProASIC3 FPGAs Radiation Effects Report | |
1 MB | 4/2010 |
| RTSX72SU SEE Report–Analysis of NASA/Goddard High Speed SET/SEU Data | |
97 KB | 3/2007 |
| RTAX-S TAMU Single Event Dielectric Rupture | |
246 KB | 9/2006 |
| RTAX-S SEE Report–Analysis of NASA/Goddard High Speed SET/SEU Data | |
138 KB | 8/2006 |
| RTAXS TAMU Single Event Latch-up Test Report | |
178 KB | 8/2006 |
| RTSX-SU SEE Heavy Ion Beam Test Report | |
47 KB | 6/2005 |
| RTAX-S SEE Report | |
645 KB | 8/2004 |
| RTAX-S SEE Data for the EDAC RAM | |
282 KB | 6/2004 |
| Radiation Performance of Microsemi Products | |
95 KB | 4/2004 |
| RT-SX .6µ Product Radiation Data Report | |
64 KB | 3/1999 |
Neutron-Induced Firm Errors
For more information, visit the Single Event Effects (SEE) page.
| Microsemi Corporation COTS and Up-Screening Policy | 66 KB | 1/2003 |
| Post-Programming Burn-In on Microsemi FPGAs | 471 KB | 1/2003 |
| RadHard FAQ | 103 KB | 3/1997 |
Quality & Reliability Reports
| Microsemi SoC Reliability Report - Rev. 12 | |
3 MB | 10/2014 |
High Reliability White Papers
Radiation Effects Conferences
Information about radiation effects in semiconductors and, in particular, FPGAs is presented by a wide range of researchers, academia, and semiconductor suppliers in the conferences listed below:
- Nuclear Space Radiation Effects (NSREC) Conference
- Single Event Effects Symposium and Military and Aerospace Programmable Logic Devices (MAPLD) Workshop
- Radiation Effects on Components and Systems (RADECS) Conference
Conference Papers
Total Ionizing Dose (TID)
Total Ionizing Dose (TID) is caused by radiation due to charged particles and gamma rays in Space. This radiation deposits energy by causing ionization in the material. The ionization can change the charge excitation, charge transport, bonding, and decomposition properties of the material, and therefore, the device parameters. Total dose is the cumulative ionizing radiation that an electronic device receives over a specified period of time. The damage is dependant on the amount of radiation and how long it took to accumulate the total dose and is expressed in RAD (Radiation Absorbed Dose). Microsemi performs wafer lot specific TID testing per TM1019 of Mil-Std 883 class B. Test reports are posted here for customers' information. The results obtained do not constitute a guarantee that all units from each wafer lot will meet the TID levels observed in sample testing.
RT ProASIC3 TID Reports
| RT3PE3000L-CG484-QKN6Y TID Report | |
2 MB | 8/2015 |
| RT3PE3000L-CG896-QHR8G TID Report | |
4 MB | 10/2011 |
| RT3PE600L-CG484-QJA2H TID Report | |
4 MB | 4/2011 |
| RT3PE3000L-CG484-QJA2G TID Report | |
6 MB | 2/2011 |
RTAX-S TID Reports
RTSX-S and RTSX-SU TID Reports
RT Legacy TID Reports
| RTAX1000S-CQ352-D59RP1 TID Report | |
3 MB | 2/2013 |
| RT1280-FP5986501 TID Report | |
4 MB | 8/2011 |
| RT14100A-FP2732701 TID Report | |
762 KB | 8/2008 |
| RT1280A-FP21573 TID Report | |
358 KB | 3/2008 |
| RT14100A-UBCL011 TID Report | |
319 KB | 9/2007 |
| RT1020-1980166 TID Report | |
289 KB | 11/2001 |
| RT14100A-UCL086 TID Report | |
346 KB | 9/2001 |
| RT1280A-U1H609 TID Report | |
376 KB | 6/2001 |
| RT1280A-U1H611 TID Report | |
300 KB | 4/2001 |
| RT14100-UCL082 TID Report | |
342 KB | 2/2001 |
| TR0024: Total Ionizing Dose - 00T-RT1460-UCK069 Test Report | 316.4 KB | 2/2016 | |
| RT1280A-U1H486 TID Report | |
280 KB | 3/2000 |
| RT14100A-UCL073 TID Report | |
245 KB | 11/1999 |
| RT14100A-UCL072 TID Report | |
340 KB | 10/1999 |
| RT1020-159 Rev 0 TID Report | |
202 KB | 7/1999 |
| RT1460A-UCK062 TID Report | |
59 KB | 11/1998 |
| RT1425A-UCJ014X TID Report | |
57 KB | 9/1998 |
Note: TID reports are provided for information only and do not indicate availability of product from any specific wafer lot. Please contact your local Microsemi sales office for availability information on any specific wafer lot.
Policies, Certifications & Export Compliance
Policies
- Microsemi Corporation COTS and Up-Screening Policy
- Post-Programming Burn-In (PPBI) for Microsemi RT54SX-S and A54SX-A Microsemi FPGAs
- DFARS 252.225-7014 Specialty Metal Requirement — The Berry Amendment
As of January 29, 2008 all Microsemi semiconductor products are generally exempt from the Berry Amendment specialty metal requirements pursuant to Section 804 of the FY 2008 National Defense Authorization Act which exempts all electronic components.
Certifications
Microsemi Military and Aerospace FPGAs have achieved various certifications including AS9100, QML Class Q and QML Class V per MIL-PRF-38535. For a complete list, please refer to the ICSG (Integrated Circuits & Systems Group) certifications on the Corporate Quality Certifications webpage.Export Compliance
The latest EAR Export Control Classification Numbers (ECCN) for the Microsemi radiation tolerant FPGA families are as follows:
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RTG4 Family, including RTG4 Development Kit |
9A515.e.1 |
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RTAX-S/SL/DSP Family |
9A515.e.1 |
|
RT ProASIC3 Family |
3A001.a.1.b |
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RTSX-SU Family |
9a515.e.1 |
Family Comparison
Microsemi's FPGAs facilitate the design of high speed communications payloads, high resolution sensors and instruments, and flight-critical systems that enable tomorrow's space missions. Only Microsemi can meet the power, size, cost and reliability targets that reduce time-to-launch and minimize cost and schedule risks.
Flight Heritage
Microsemi has extensive flight heritage with both Antifuse and Flash-based FPGAs.
- Microsemi has been delivering space flight FPGAs since 1996
- And has been shipping their broad space portfolio of semiconductors since 1957
RTSX-SU |
RTAX |
RT ProASIC3 |
| Introduced 2004 EAR controlled (3A001.a.2.c) QML class Q qualified |
Introduced 2005 On-board SRAM and DSP Mathblocks EAR controlled (9A515.e) QML class V qualified |
Introduced 2008 First Flash-based RT FPGA in space EAR controlled (3A001.a.2.c) QML class Q qualified |
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Mars Reconnaissance Orbiter |
Curiosity (Mars Science Lab) |
NASA IRIS |
Legacy
For over 20 years, Microsemi has delivered the most reliable field-programmable gate arrays (FPGAs) in the industry. Microsemi's high-reliability FPGAs have overall antifuse reliability ratings of less than 10 failures-in-time (FITs) and have a lifespan of more than 40 years. Microsemi FPGAs are production-proven, with more than 5 million devices shipped and more than 1 trillion antifuses manufactured. Microsemi devices are fully tested prior to shipment, with an outgoing defect level of only 122 ppm (further reliability data is available in the Microsemi Reliability Report). Additionally, the programmable architecture of these devices offers high performance, design flexibility, and fast and inexpensive prototyping-all without the expense of test vectors, NRE charges, long lead times, and schedule and cost penalties for design refinements.
Product Features
RT1020
The RT1020 device contains the same architecture as the A1020, A1020A, and A1020B devices. The architecture, a combinatorial logic module, is a logic structure with 8 inputs and 1 output. The logic itself is comprised of a 4-input MUX. In addition, since the RT1020 device contains the same number of gates and I/Os and has the same operating voltage as its commercial equivalent (A1020B), an inexpensive commercial grade A1020B-CQ84 device can be used during the prototype phase, and replaced by the RT1020 in the flight units.
RT1280
The RT1280A device uses the A1280A die from the ACT 2 family of FPGAs. It utilizes a 2-module architecture, consisting of combinatorial modules (C-modules) and sequential modules (S-modules) optimized for both combinatorial and sequential designs. Based on Microsemi's patented channeled array architecture, the RT1280A has 8,000 ASIC-equivalent gates and 140 user I/Os.
RT ACT 3
The RT1425A, RT1460A and RT14100A devices use the A1425A, A1460A and A14100A dies, respectively. These devices are derived from the ACT 3 family of FPGAs, which also utilizes the two-module channeled array architecture, and offers faster performance than the RT1280A. These devices also have fully pin- and function-compatible, commercially-equivalent devices for easy and inexpensive prototyping. The A1425A-CQ132C is used for the RT1425A, the A1460A-CQ196C is used for the RT1460A, and the A14100A-CQ256C is used for the RT14100A.
Key Features
- 4,000 to 20,000 logic equivalent gates
- 2,000 to 10,000 ASIC equivalent gates
- Up to 85 MHz internal performance
- Up to 60 MHz system performance
- Up to 228 user I/Os
- Up to four fast, low-skew clock networks
- Packages: 84-pin, 132-pin, 172-pin, 196-pin, and 256-pin ceramic quad flat pack
- Offered as Class B and E-Flow (Microsemi Space Level Flow)
- QML certified devices
- 100% military temperature tested (-œ55 °C to +125 °C)
Radiation Performances
- Tested Total Ionizing Dose (TID) survivability level
- No Single Event Latch-Up (SEL) below a minimum Linear Energy Transfer (LET) threshold of 80 MeV-cm2/mg for all RT (RadTolerant) devices
Radiation Survivability
Total dose results are summarized in two ways. The first method summarizes by the maximum total dose level that is reached when the parts fail to meet a device specification but remain functional. For Microsemi FPGAs, the parameter that exceeds the specification first is the standby supply current (ICC). The second method summarizes by the maximum total dose that is reached prior to the functional failure of the device. The Microsemi RT devices have varying total-dose radiation survivability. The ability of these devices to survive radiation effects is both device- and lot-dependent. You must evaluate and determine the applicability of these devices for specific design and environmental requirements. Typical results for the RT1020 device are ~100krads (Si) for standby ICC and >100 krads for functional failure. The RT1280A device has results from 4 to 10 krads (Si) for standby ICC, and 7 to 18 krads for functional failure. Typical results for ACT 3 devices are 10 to 28 krads for ICC, and 20 to 77 krads for functional failure. Microsemi will provide total dose radiation testing along with the test data on each pedigreed lot that is available for sale. This summary also shows single event upset (SEU) and single event latch-up testing that has been performed on Microsemi FPGAs.
Product Table
| Devices | RT1020 | RT1280A | RT1425A | RT1460A | RT14100A |
|---|---|---|---|---|---|
| Capacity | |||||
| System Gates | 6,000 | 24,000 | 7,500 | 18,000 | 30,000 |
| Logic Gates | 4,000 | 16,000 | 5,000 | 12,000 | 20,000 |
| ASIC Equivalent Gates | 2,000 | 8,000 | 2,500 | 6,000 | 10,000 |
| PLD Equivalent Gates | 5,000 | 20,000 | 6,250 | 15,000 | 25,000 |
| TTL Equivalent Gates | 50 | 200 | 60 | 150 | 250 |
| 20-pin PAL Equivalent Packages | 20 | 80 | 25 | 60 | 100 |
| Logic Modules | 547 | 1,232 | 310 | 848 | 1,377 |
| S-Modules | N/A | 624 | 160 | 432 | 697 |
| C-Modules | 547 | 608 | 150 | 416 | 680 |
| Maximum User I/Os | 69 | 140 | 100 | 168 | 228 |
| Performance | |||||
| System Speed (Maximum) | 20 MHz | 40 MHz | 60 MHz | 60 MHz | 60 MHz |
| Speed Grades | Std., -1 | Std., -1 | Std., -1 | Std., -1 | Std., -1 |
| Temperature Grades | E, B | E, B | E, B | E, B | E, B |
| Packages (by pin count) | |||||
| CQFP | 84 | 172 | 132 | 196 | 256 |
Design Software
The Legacy RT devices are fully supported by Microsemi Libero IDE, a design management environment that guides the user through the FPGA design flow and provides seamless design tool integration as well as project, data file, and log file management. Libero IDE enables users to integrate both schematic and HDL synthesis into a single flow and verify the entire design in a single environment.Prototyping
An inexpensive commercial grade A1020B-CQ84 device can be used during the prototype phase, and replaced by the RT1020 in the flight units. The RT1280A device is fully pin- and function-compatible with the commercially-equivalent A1280A-CQ172C device for easy, inexpensive prototyping. The RT ACT3 devices also have fully pin- and function-compatible, commercially-equivalent devices for easy and inexpensive prototyping. The A1425A-CQ132C is used for the RT1425A, the A1460A-CQ196C is used for the RT1460A, and the A14100A-CQ256C is used for the RT14100A.Programmers
Programming support for Legacy RT devices is provided through Microsemi's Silicon Sculptor 3, a PC-based programmer that delivers high data throughput and promotes ease of use, while lowering the overall cost of ownership. Microsemi offers a unique in-system diagnostic and verification capability with Silicon Explorer II, Microsemi's integrated verification and logic analysis tool.Datasheets
| RadTolerant FPGAs v3.1 | 343 KB | 10/2004 |
Packaging Data
| Package Mechanical Drawings (Revision 44) | 6 MB | 5/2013 |
| Package Thermal Characteristics and Weights | 388 KB | 11/2012 |
| Hermetic Package Mechanical Configuration | 24 KB | 11/2003 |
Application Notes
Discontinued
Discontinued devices are FPGAs that Microsemi has ceased shipping. All stocks have been exhausted, and these products are no longer available from Microsemi. For more information about Microsemi's discontinued products, read the product-related Product Discontinuation Notifications (PDN).
RTSX-S / RTSX
| Devices | RT54SX32S | RT54SX72S | RT54SX16 | RT54SX32 | |
|---|---|---|---|---|---|
| Speed Grades | Std., -1 | Std., -1 | Std., -1 | Std., -1 | Std., -1 |
| Temperature Grades |
B, E | M | B, E | B, E | B, E |
| Packages | CQ208, CQ256 | CC256 | CQ208, CQ256 | CQ208, CQ256 | CQ208, CQ256 |
RT/RH
| Devices | RT1020 | RH1020 | RH1280 |
|---|---|---|---|
| Speed Grades | Std. | Std. | Std. |
| Temperature Grades | B, E | V | V |
| Packages | CQ84 | CQ84, Dielot | CQ172, Dielot |
RTSX-S
| RTSX-S RadTolerant FPGAs for Space Applications v2.2 | 659 KB | 11/2004 |
RTSX
| 54SX Family FPGAs RadTolerant and HiRel v2.1 | 376 KB | 3/2005 |
| 54SX Family FPGAs RadTolerant and HiRel Errata Errata v2.0 | 35 KB | 3/2003 |
RT/RH
| HiRel FPGAs v3.0 | 1 MB | 1/2000 |
| Radiation-Hardened FPGAs v3.1 | 243 KB | 4/2005 |
| RadTolerant FPGAs v3.1 | 343 KB | 10/2004 |
Policies
- Microsemi Corporation COTS and Up-Screening Policy
- Post-Programming Burn-In (PPBI) for Microsemi RT54SX-S and A54SX-A Microsemi FPGAs
- DFARS 252.225-7014 Specialty Metal Requirement — The Berry Amendment
As of January 29, 2008 all Microsemi semiconductor products are generally exempt from the Berry Amendment specialty metal requirements pursuant to Section 804 of the FY 2008 National Defense Authorization Act which exempts all electronic components.
Certifications
Microsemi Military and Aerospace FPGAs have achieved various certifications including AS9100, QML Class Q and QML Class V per MIL-PRF-38535. For a complete list, please refer to the ICSG (Integrated Circuits & Systems Group) certifications on the Corporate Quality Certifications webpage.Export Compliance
The latest EAR Export Control Classification Numbers (ECCN) for the Microsemi radiation tolerant FPGA families are as follows:
|
RTG4 Family, including RTG4 Development Kit |
9A515.e.1 |
|
RTAX-S/SL/DSP Family |
9A515.e.1 |
|
RT ProASIC3 Family |
3A001.a.1.b |
|
RTSX-SU Family |
9a515.e.1 |
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