PolarFire FPGA Development Kits | Microsemi

PolarFire FPGA Development Kits

Overview

Microchip offers an extensive range of development kits purpose-built for easy evaluation of the capabilities and features of the PolarFire family so you can quickly get to work prototyping your products and applications.

Microsemi and their distribution partners have created boards to allow customers to evaluate PolarFire FPGAs and to fully develop their applications.

Video and Imaging Kit	Device: MPF300TS-1FCG1152I Price: $999 Sony Dual Camera Sensor (IMX334) over Amphenol FCI connector (CSI-2 RX) HPC FMC Connector 4GB DDR4 x32 Power Management Unit for 1 or 1.05v PolarFire FPGA core voltage USB to UART Interface Embedded programming and debugging using SPI and JTAG 1x 1Gb SPI Flash Memory HDMI 2.0 RX and TX HDMI 1.4 TX DSI Connector CSI-2 TX Connector
PolarFire FPGA Evaluation KIt	Device: MPF300TS-1FCG1152I Price: $1495 4GB 32Bit DDR4 x32, 2GB 16Bit DDR3 x16, and 2x 1Gb SPI Flash Memory 2x RJ45 Ports with PHY for Ethernet -1588 Applications Support for SFP+ interface and IOG Loopback High-Speed SERDES Interface 4x FMC Connector (HPC) Feasible Programmability using Embedded FlashPro5, External FlashPro4/5, SPI Slave, IAP programming and Debug Support In Silicon Temperature Monitoring SATA interface(using FMC Connector) On Board 50MHz System Clock
PolarFire FPGA Splash Kit	Device: MPF300T-1FCG484E Price: $699 x32 Bit DDR4 and 1Gb SPI Flash Memory RJ45 Port with PHY for RGMII Interface FMC Connector (LPC) Prototype Breadboard area PCI Express (x4) Edge Connector Feasible Programmability using Embedded FlashPro5, External FlashPro4/5, SPI Slave, IAP programming and Debug Support On-Board 50MHz System Clock
CoaXPress FMC Daughter Card	Device: MPF100T-FCSG325E Price: $849 Device board 12.5g CoaXPress PHY (EQCO125X40) 100k LE PolarFire device in FCSG325 package 1 Micro BNC Connectors –TX JTAG – programming (FP4) Host Board 12.5g CoaXPress PHY (EQCO125X40) HPC FMC Connector 1 Micro BNC Connector – RX
SDI FMC Daughter Card	Device: N/A Price: $499 Onboard 148.5MHz Oscillator Equalizer on RX path Driver and Re-clocker on TX path HPC FMC
USXGMII FMC Daughter Card	Device: N/A Price: $499 Quadrate Aquantia PHY RJ45 connector HPC FMC
PCIe Root Port Adapter Card	Device: None Price: $349 Evaluate the hard PCI Express protocol stack embedded within every PolarFire device using the PCIe Root Port Adapter Card
Aries Embedded M100PF SoM	Devices: MPF100T, MPF200T, MPF300T Price: Available from Aries Embedded 512 MiB / 1 GiB / 2 GiB DDR3 RAM 256 MiB configuration device 4 GiB eMMC memory 8 SERDES Lanes, 250Mbps to 12.5Gbps 2 PCIe Gen2 End Points/Root Ports Single 3,3V supply Size 74mmx42mm 2 x Samtec QSH-090-01-F-D-A board-to-board interconnect
Arrow Everest Board	Device: MPF300TS-1FCG1152EES Price: $599 Triple 1GbE interface 1 x 10GbE SFP+ cage PCI Express (x 4) Gen2 Dual DDR3L (x32 and x16) High-speed FMC (HPC) expansion HDMI Output Expansion Connectors: PMOD Other low-speed interfaces: UART, SPI, and I2C
Future Avalanche Board	Device: MPF300TS-FCG484EES Price: $179.95 1GbE interface w/PHY (VSC8531) WiFi Module Expansion Connectors: Arduino Shield,mikroBUS, PMOD DDR3 SDRAM (256Mx16) SFP Cage 64Mbit SPI Flash Other low-speed interfaces: UART & JTAG LEDs & User Buttons
Sundance DSP SoM1-MPF500T	Device: MPF500T Price: Available from Sundance DSP 2 chips MT40A1G16 from Micron(stacked 2 x8 8Gb chips) – total 32Gbits of DDR4-1600 512Mbit SPI Flash for bitstream and other code storage, by default, flash will not be soldered Flexible clocking IC – SI5338A-B-GM with 50MHz ±20ppm reference oscillator Built in FPGA internal oscillator for configuration and other purposes B2B Connectors: 4 x 160 Pins from Samtec – ST5-80-1.50-L-D-P-TR Small footprint of 76 x 52 mm. Temperature range 0°C to +65°C
Sundance DSP SoM2-MPF300T	Device: MPF300T Price: Available from Sundance DSP Small 76 x 52 mm footprint Below 10 Watts Max FPGA power consumption 512Mbit SPI Flash for bitstream and other code storage Flexible clocking IC – SI5338A-B-GM with 50MHz ±20ppm reference oscillator B2B Connectors: 4 x 160 Pins from Samtec – ST5-80-1.50-L-D-P-TR 1600Mbps MAX LVDS I/O speed is 1600Mbps Temperature range 0°C to +65°C Power IN from 3.3V to 5.5V
Sundance DSP SoM3-MPF300T	Device: MPF300T Price: Available from Sundance DSP 40 x 50 mm 4GB DDR4 SPI FLASH 10/100/1000Mbit Ethernet PHY SI5338A-B-GM with 25MHz ±10ppm reference oscillator Total User I/O: (HSIO/GPIO)/XCVRs -> 284(120/164)/4

Features	PolarFire Boards
Features	Imaging and Video Kit	Evaluation Kit	Splash Kit	Arrow Everest	Future Avalanche	Sundance SoM-3
PCIe	No	Yes	Yes	Yes	No	No
Memory	DDR4	DDR3, DDR4	DDR4	DDR3L x32	DDR3	DDR4
FMC	HPC FMc	Yes	LPC FMC	Yes	No	No
Network Interfaces	USB-UART Terminal	10G cage, 2 x 1G RJ45 SGMII on GPIO 8575	1G RJ45 RGMII via 8541	10G cage,3 x 1G RJ45 SGMII on GPIO 8575	1G RJ45 via 8531	10/100/1000Mbit Ethernet PHY
Other Network components		1588 via 30634	-	1588 via 30722	SFP Cage
Display	HDMI 2.0, 1.4, DSI, CSI-2 Tx, SDI	-	-	HDMI via ADI PHY
Connectors (other than FMC)	Amphenol FCI, Display Connectors	SMAs		PMOD	Arduino, PMOD MikroBus Connectors
Other	NVIDIA Jetson Interface, Power Management Unit	Power Measurement	Power Measurement		Wi-Fi Module
Resale	$999	$1495	$699	$499	$179	Contact Sundance

Parametric Search

« Prev
{{n+1}}
Next »

Showing per page

There are no matching parts in this category

Parts Total: {{ctrl.partCount}} Matching: {{ctrl.filteredCount}}	Part Status {{statusOpt}}	{{alphanumeric.name}} {{alphanumeric.type == 'f' ? (value == 1 ? 'Yes':value == 0 ? 'No':value): value}}		Package Type {{packageOpt}}	Package Carrier {{carrierOpt}}

Parts	Part Status	package Type	Package Carrier	{{attribute.name \| noComma}} ({{attribute.type}})

This category has no Parametric Data! please try other Categories

Ordering

Support

FPGA & SoC

Products | Applications | Company | Careers | Investors | Survey | Privacy Policy | Terms & Conditions | Product Disclaimer | Terms of Use | Blog |

© 2019 Microsemi, a wholly owned subsidiary of Microchip Technology Inc. All rights reserved.
Microsemi and the Microsemi logo are registered trademarks of Microsemi Corporation. All other trademarks and service marks are the property of their respective owners.