PolarFire FPGA Development Kits

Video and Imaging Kit

• Sony Dual Camera Sensor (IMX334) over Amphenol FCI connector (CSI-2 RX)
• HPC FMC Connector
• 4GB DDR4 x32
• Power Management Unit for 1 or 1.05v PolarFire FPGA core voltage
• USB to UART Interface
• Embedded programming and debugging using SPI and JTAG
• 1x 1Gb SPI Flash Memory
• HDMI 2.0 RX and TX
• HDMI 1.4 TX
• DSI Connector
• CSI-2 TX Connector

PolarFire FPGA Evaluation KIt

• 4GB 32Bit DDR4 x32, 2GB 16Bit DDR3 x16, and 2x 1Gb SPI Flash Memory
• 2x RJ45 Ports with PHY for Ethernet -1588 Applications
• Support for SFP+ interface and IOG Loopback
• High-Speed SERDES Interface
• 4x FMC Connector (HPC)
• Feasible Programmability using Embedded FlashPro5, External FlashPro4/5, SPI Slave, IAP programming and Debug Support 
• In Silicon Temperature Monitoring
• SATA interface(using FMC Connector)
• On Board 50MHz System Clock

PolarFire FPGA Splash Kit

• x32 Bit DDR4 and 1Gb SPI Flash Memory
• RJ45 Port with PHY for RGMII Interface
• FMC Connector (LPC)
• Prototype Breadboard area  
• PCI Express (x4) Edge Connector
• Feasible Programmability using Embedded FlashPro5, External FlashPro4/5, SPI Slave, IAP programming and Debug Support
• On-Board 50MHz System Clock

PCIe Root Port Adapter Card

• Evaluate the hard PCI Express protocol stack embedded within every PolarFire device using the PCIe Root Port Adapter Card

Aries Embedded M100PF SoM 

• 512 MiB / 1 GiB / 2 GiB DDR3 RAM
• 256 MiB configuration device
• 4 GiB eMMC memory
• 8 SERDES Lanes, 250Mbps to 12.5Gbps
• 2 PCIe Gen2 End Points/Root Ports
• Single 3,3V supply
• Size 74mmx42mm
• 2 x Samtec QSH-090-01-F-D-A board-to-board interconnect

Arrow Everest Board

• Triple 1GbE interface 
• 1 x 10GbE SFP+ cage
• PCI Express (x 4) Gen2
• Dual DDR3L (x32 and x16) 
• High-speed FMC (HPC) expansion
• HDMI Output
• Expansion Connectors: PMOD
• Other low-speed interfaces: UART, SPI, and I2C 

Future Avalanche Board

• 1GbE interface w/PHY (VSC8531)
• WiFi Module
• Expansion Connectors: Arduino Shield,mikroBUS, PMOD
• DDR3 SDRAM (256Mx16)
• SFP Cage
• 64Mbit SPI Flash
• Other low-speed interfaces: UART & JTAG
• LEDs & User Buttons

Sundance DSP SoM1-MPF500T 

• 2 chips MT40A1G16 from Micron(stacked 2 x8 8Gb chips) – total 32Gbits of DDR4-1600
• 512Mbit SPI Flash for bitstream and other code storage, by default, flash will not be soldered
• Flexible clocking IC – SI5338A-B-GM with 50MHz ±20ppm reference oscillator
• Built in FPGA internal oscillator for configuration and other purposes
• B2B Connectors: 4 x 160 Pins from Samtec – ST5-80-1.50-L-D-P-TR
• Small footprint of 76 x 52 mm.
• Temperature range 0°C to +65°C

Sundance DSP SoM2-MPF300T 

• Small 76 x 52 mm footprint
• Below 10 Watts Max FPGA power consumption
• 512Mbit SPI Flash for bitstream and other code storage
• Flexible clocking IC – SI5338A-B-GM with 50MHz ±20ppm reference oscillator
• B2B Connectors: 4 x 160 Pins from Samtec – ST5-80-1.50-L-D-P-TR
• 1600Mbps MAX LVDS I/O speed is 1600Mbps
• Temperature range 0°C to +65°C
• Power IN from 3.3V to 5.5V

 Sundance DSP SoM3-MPF300T

• 40 x 50 mm
• 4GB DDR4 
• SPI FLASH 
• 10/100/1000Mbit Ethernet PHY
• SI5338A-B-GM with 25MHz ±10ppm reference oscillator
• Total User I/O:   (HSIO/GPIO)/XCVRs  -> 284(120/164)/4