Name: | PCN 0504: Qualification of New Mold Compound and Die Attach Material at Amkor-Korea for TQFP 100 Packages Containing Lead |
Filesize: | 304.42 kB |
Filetype: | zip (Mime Type: application/zip) |
Document Group: | Everybody |
Last updated on: | 04/20/2005 00:00 |