
Literature
Documents
Document Name | Size | Published | Modified | |
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Small Cell Solutions | 2.47 MB | 11/10/2014 | 03/05/2015 |
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Single CCFL Lamp Modules | 1.31 MB | 11/30/-1 | 11/30/-1 |
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Sigma Surveillance Case Study | 834.09 kB | 08/20/2014 | 08/20/2014 |
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Sensors & Semiconductor Diodes Selection Guide | 837.15 kB | 11/30/-1 | 11/30/-1 |
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RF & Microwave Diode and Transistor Product Catalog | 3.39 MB | 11/30/-1 | 07/14/2015 |
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Reverse Power Feed (RPF): Benefits and Constraints
G.Fast Summit May 2014
Reverse Power Feeding (RPF): Benefits and Constraints |
509.87 kB | 10/17/2014 | 10/17/2014 |
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Reducing the cost of extending Power over Ethernet
Extenders coupled with four-pair powering make up a cost-effective approach to reaching distant powered devices.
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Unknown | 10/17/2014 | 10/17/2014 |
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PowerView Pro 3 User Guide | Unknown | 07/23/2014 | 08/19/2014 |
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Powermite Surface Mount Power Packages | 2.84 MB | 11/30/-1 | 11/30/-1 |
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Powering PoE Compliant PCs
This article will examine the requirements and challenges associated with implementing the latest high-power IEEE 802.3at technology in a wide variety of portable platforms. The new pending standard is poised to greatly reduce the need for batteries in notebooks and other remote/mobile products. Achieving this, however, requires a more than doubling of the power-delivery capabilities of the earlier IEEE 802.3af solutions with important system-level implications. Overall power consumption and power concentration are two key parameters to be considering when deciding to power company-wide applications such as laptops, and in many cases a smart combination of low- and high-power devices and the utilization of Midspans in combination with PoE switches can give the right balance to allow servicing these new high power applications in a cost effective manner.
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Unknown | 10/17/2014 | 10/17/2014 |
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Powering Next-Generation Endpoints
Making the Case for Power Over Ethernet Midspans
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477.11 kB | 06/04/2014 | 08/19/2014 |
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Power Semiconductors, Power Modules and RF Power MOSFETs Catalog High-Voltage SMPS Transistors: Insulated Gate Bipolar Transistors (IGBTs), Silicon Carbide (SiC) MOSFETs, Power MOS 8™ MOSFETs/FREDFETs, Ultra-Fast, Low Gate Charge MOSFETs, Super Junction MOSFETs, Linear MOSFETs Diodes: SiC Schottky Barrier Diodes, Si Schottky Barrier Diodes, Fast and Ultra-Fast Recovery Diodes High-Voltage RF MOSFETs, High-Frequency RF MOSFETs, Drivers and Driver-RF MOSFET Hybrids Reference Design Kits Power Modules: IGBT Power Modules, Intelligent Power Modules, MOSFET Power Modules, Renewable Energy Power Modules, Power Modules with SiC Schottky Diodes, SiC MOSFET Power Modules, Diode Power Modules |
3.96 MB | 05/30/2018 | 05/30/2018 |
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Power over Ethernet Plus: The next step This exclusive overview from the chair of the Ethernet Alliance PoE/PoEPlus Technical Committee outlines the history of Power over Ethernet (PoE) and highlights the improvements on the horizon in the IEEE P802.3at draft. |
Unknown | 10/17/2014 | 10/17/2014 |
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PoE's role in HDBaseT consumer digital connectivity
Power-over-HDBaseT technology will enable the RJ45 jack to be the first universal power plug
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Unknown | 10/17/2014 | 10/17/2014 |
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Phase Noise Introduction | 542.38 kB | 05/14/2013 | 05/14/2013 |
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PD25012L/PD25012H Evaluation Board, User Guide | 2.11 MB | 07/28/2015 | 07/28/2015 |
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Package Miniaturization Services: Embedded Die | 1.76 MB | 10/23/2015 | 10/23/2015 |
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NX9548 Evaluation Board User Guide | 827 kB | 05/16/2013 | 05/16/2013 |
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NX2423 1x2in Evaluation Board User Guide | 412.6 kB | 01/03/2013 | 01/03/2013 |
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MSCC DC Selection Guide | 591.51 kB | 03/28/2014 | 03/28/2014 |