Datasheets

The UMX5601TM PIN diode series was designed to provide ultra low magnetic PIN diodes for in bore surface coil applications associated with higher field strength (3T and greater) MR scanners. These PIN diodes produce the minimum artifacts (magnetic field distortions) available in the industry, today. The diodes have been tested in magnetic fields of ±7 Tesla. The UMX5601 PIN diodes have a magnetic moment at 7 T of 4E-8 (J/T). The diodes are offered in a surface mount package. The SM package utilizes a round end cap to mark the anode. The cathode is square. The fully passivated PIN diode chip is full face metallurgically bonded to shortened high conductive pins for lower thermal and electrical resistances. The PIN diodes feature low forward bias resistance and high zero bias impedance. The UMX5601 PIN diodes are characterized at 64, 128, and 300 MHz. The UMX5601SM meets RoHS requirements per EU Directive 2002/95/EC.

The UMX9989AP is the first MRI switching diode module, designed to optimize performance and reduce assembly labor, cost, and polarity errors. There are two principle applications for which the UMX9989AP modules are intended: 1) MRI receiver protection from high RF energy fields, including long RF pulses and RF spike pulses present in most MRI machines. The UMX9989AP acts as a passive protector (limiter) for the MRI receiver’s LNA. The diode assembly exhibits extremely low insertion loss, both in the “on” state (high power present) and the “off” state (receiver power present) so the Receiver’s Noise Figure is not increased by the protector circuit. 2) Passive switching of surface coil detuning and blocking circuits. In this case, the flow of loop current during transmitter pulse turns on the diodes, without a switch driver.

UPR20, UPR30 and UPR40 datasheet

UPS120e3 Data sheet

The Microsemi UPS140e3 Powermite® Schottky rectifier is RoHS compliant and offers optimized forward voltage characteristics with reverse blocking capabilities up to 40 Volt. They are ideal for surface mount applications that operate at high frequencies. In addition to its size advantages, Powermite® package features include a full metallic bottom that eliminates possibility of solder flux entrapment during assembly, and a unique locking tab acts as an efficient heat path from die to mounting plane for external heat sinking with very low thermal resistance junction to case (bottom). Its innovative design makes this device ideal for use with automatic insertion equipment.

UPS160e3 datasheet

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In Microsemi’s new Powermite3® SMT package, these high efficiency ultrafast rectifiers offer the power handing capabilities previously found only in much larger packages. They are ideal for SMD applications that operate at high frequencies. In addition to its size advantages, Powermite3® package features include a full metallic bottom that eliminates the possibility of solder flux entrapment during assembly, and a unique locking tab acts as an integral heat sink. Its innovative design makes this device ideal for use with automatic insertion equipment.

This UPS360e3 in the Powermite3® package is a high efficiency Schottky rectifier that is also RoHS compliant offering high current/power capabilities previously found only in much larger packages. They are ideal for SMD applications that operate at high frequencies. In addition to its size advantages, the Powermite3® package includes a full metallic bottom that eliminates the possibility of solder flux entrapment during assembly and a unique locking tab act as an efficient heat path to the heat-sink mounting. Its innovative design makes this device ideal for use with automatic insertion equipment.