Embedded Die Technology
Package Miniaturization with Embedded Die Technology
Microsemi's Package Miniaturization Services utilize Large Area Panel (LAP)-based embedded die technology to perform sub-system size reduction levels that cannot be achieved via standard chip-on-board technology. Microsemi's embedded die technology offers quality, reliability, and security, enabling practical implementations of systems on a package with real-estate savings of up to 70% versus the original PCB area.
Practical applications of embedded die technology include:
- Medical Implants
- Medical Wearable Devices
- Sports/Fitness Devices
- Industrial Sensing
Embedded Die Technology Features and Benefits
|Die "zero area occupancy"||Reduce size or increase functional density|
|3D die stacking||Vertical integration for additional size reductions|
|Flip chip, wire bond or packaged part||Flexible system integration|
|Custom package design||Adapt package to meet customer board requirements|
|Low tooling cost||Fast turnaround for custom design services projects|
|Mechanical barrier supporting the die||Package robustness|
|MIL-standard for implantable devices compatible||Highly reliable|
|Hidden die||Increased security against counterfeiting|
Case Study: ZL70323 Radio Module
Microsemi offers an RF Standard Implant Module (SIM) based on the ZL70103 MICS telemetry device for implant OEMs looking to speed up the development cycle and mitigate risks by using an approved design. The emerging Neuro-Stimulation OEMs needed to develop smaller devices to aid patient comfort. To meet this need, Microsemi's Package Miniaturization Services group took the existing SiP design and used Microsemi's embedded die technology to integrate the ZL70103 into the substrate. As a result, the support components fit within the area of the die, enabling a near zero area die occupancy and a module footprint reduction of 70%!
|Standard System in Package (SiP) Technology||Embedded Die Technology|
|Area: 12mm x 7mm = 84mm2||Area: 5.5mmx4.5mm = 24.75mm2|
Ready to learn more? Contact your local Microsemi sales office today to find the right technologies and products for your design needs.