Microsemi RTG4 CQ352 Status Update

Microsemi has introduced a ceramic quad flat pack (CQFP) package with 352 pins for the RTG4 FPGA family to provide more cost-effective integration than that of higher pin count packages. CQFP is the industry-standard package for space applications with well-established board integration and inspection procedures.

RTG4 devices in CQ352 packages are available in the Libero SoC software tool set, allowing customers to design with this new device package combination. We recommend customers to download the latest version of Libero SoC software to take advantage of the recent update to the pin assignments. RTG4 CQ352 Proto devices are available now, subject to lead times. Proto devices have the same package design as flight units and are tested across the full military temperature -55°C to 125°C. B-flow and E-flow space flight units are expected in early 2019 when the MIL-STD-883 Class B qualification is completed for RTG4 CQ352. Upon qualification, RTG4 CQ352 in B-flow and E-flow will be added to the SMD from DLA.

For more information, please contact Minh.Nguyen@microchip.com.

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