Ceramic Quad Flat Pack (CQFP) for RTG4 FPGAs Family Introduced – Provides Cost-Effective Integration

A ceramic quad flat pack (CQFP) package with 352 pins was recently introduced for RTG4 FPGAs family to provide a more cost-effective integration than higher pin count packages. CQFP is the industry-standard package for space applications with well-established board integration and inspection procedures.

The CQ352-packaged RTG4 device is now available in the Libero SoC software tool set, allowing customers to design with this new device package combination. Customers should download the latest version of Libero SoC software to take advantage of the recent update to the pin assignments. The RTG4 CQ352 Proto devices are available now, subject to lead time. Proto devices have the same package design as flight units, and are tested across the full military temperature range (–55 °C to 125C125 °C). B-flow and E-flow space flight units are expected in July 2018, when the MIL-STD-883 Class B qualification is completed for RTG4 CQ352. Upon qualification completion, RTG4 CQ352 in B-flow and E-flow will be added to the SMD from DLA.

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