About Microsemi News Events Contact Employment Home
keyword
search:
 part number
search:

RoHS / Pb-free Initiative - Integrated Products Division

Microsemi, Integrated Products Group (MSC-IP) is committed to taking an active role in protecting the environment. We are dedicated to developing and maintaining Products, Processes, and Environmental Management Systems that meet government regulations, international standards, and our customer’s expectations. As part of this commitment, MSC-IP has qualified and transitioned our product line to meet these requirements following a different strategy for our plastic encapsulated, inverter and hermetic product lines.

MSC-IP RoHS / Pb-free plastic encapsulated packages include the following characteristics:

  • RoHS / Pb-free finish (100% matte tin plating in most cases, a few NiPdAg).
  • Mold compounds and die attach material qualified for use with peak (260+0/-5°C) reflow profiles typically used with RoHS / Pb-free solder.
  • Backwards compatibility to PbSn solders.
  • MSL level 1 rating unless otherwise stated in datasheet.
  • "Green" mold compounds and die attach materials (i.e. meets the RoHS requirements and no antimony based flame retardants).
  • Some higher power packages (TO-220, TO-263 and Powerflex) continue to use high Pb solder die attach and are RoHS compliant only by exemption.

MSC-IP has discontinued production of the non RoHS / Pb-free plastic encapsulated products. Since these plastic encapsulated devices were transitioned to Pb-free and/or RoHS compliance the part numbers were not changed, rather the transaction was controlled by date code.  This date code can be found in the order block on page one of each individual datasheet and by package type in RoHS / Pb-free Package Availability Plan.

The MSC-IP inverter product line is also available as RoHS compliant. In the case of the inverters the part numbers did change as both types are still in production. The newer RoHS compliant inverters have the addition of a ‘G’ in the part number prefix as in ‘LXMG1623-12-41’ rather than the original ‘LXM1623-12-41’. Our current plans include building both versions through the end of calendar year 2006, and then ceasing production on the non RoHS LXM version. The new inverters are form, fit and functional equivalents to the older non-compliant versions.

Many of the hermetic products manufactured by MSC-IP are processed in accordance with the requirements specified by government and defense contractors which have specific guidelines regarding lead finish. These requirements at this time require the use of Pb/Sn lead finishes, therefore MSC-IP will continue to build these hermetic products as before using the same part numbers. In addition we have qualified new versions of these hermetic packages with a RoHS compliant SnAgCu lead finish. These new hermetic devices will have the addition of ‘e1’ suffix i.e. SG1524BJe1.

Additional information is located in the following related links:

Additional information is located in the following related links:
RoHS / Pb-free Transition Strategy
RoHS / Pb-free Package Availability Plan
RoHS / Pb-free Package Characteristics
RoHS / Pb-free Generic Qualification Plan
RoHS / Pb-free Package Qualification Reports
Frequently Asked Questions
Solder re-flow Profile
Contact us

 

Privacy Policy | Site Map

Avionics | Backlight Inverters | L-Band Radar | LED Driver | LDMOS & VDMOS | MOSFETs, IGBTs, & Diodes | Pin Diodes | Power Modules
RF Power & Bipolar Transistors | S-Band Radar | SCR | Thyristors | Varacter Diode | WLAN Power Amplifier | Zener Diode | Power Over Ethernet | IEEE802.3af | PoE ICs

Copyright © 2008 Microsemi Corporation. All rights reserved