IRVINE, Calif., Jan 26, 2010 (GlobeNewswire via COMTEX News Network) -- Microsemi Corporation (Nasdaq:MSCC), a leading manufacturer of high performance analog/mixed signal integrated circuits and high reliability semiconductors, today announced it has partnered with specialty foundry provider MagnaChip Semiconductor LLC to develop advanced mixed-signal process technology that is optimized for products in Microsemi's key commercial growth markets. The new process is electrically compatible with MagnaChip's own 0.35-micron baseline process that is already used by Microsemi to manufacture current products.

Microsemi and MagnaChip have completed a 24-month joint R&D project for a 0.35-micron, 72 volt (V) version of MagnaChip's proven power process technology, which combines Bipolar technology for analog control, Complementary metal-oxide semiconductor (CMOS) technology for
digital control, and Diffused MOS (DMOS) technology for handling the high
currents required for managing on-chip or system power. One of the advanced features of this Bipolar CMOS DMOS (BCD) process is its innovative deep trench isolation technique, which reduces transistor pitch and off-state leakage current while improving latch-up immunity, resulting in a higher degree of integration for complex power management ICs.

The enhanced BCD process technology includes proprietary Microsemi devices and structures that are optimized for its targeted product applications to reduce die size, improve overall analog performance, and enhance device performance in high-current situations. The two companies are also working on a second enhanced process technology for additional product applications, which will be released after designs have been validated.

"This is a first key step in expanding our technology portfolio to include a variety of custom processes
for the next generation of LED and CCFL lighting products as well as many other future product areas," said James Aralis, Microsemi Vice President of R&D. "The combination of these processes and custom device technologies with our world-class system and IC design capabilities will enable our team to develop highly differentiated and cost-effective products for customers across the full range of our targeted market segments."

Dr. T.J. Lee, Senior Vice president of MagnaChip Semiconductor Manufacturing Services Engineering, commented, "Our goal is to build solid, strategic relationships with foundry customers through outstanding customer service and high quality products. Microsemi exemplifies this type of customer and we are very pleased to partner with industry leader Microsemi to develop our 0.35-micron advanced BCD process. The successful partnership between MagnaChip and
Microsemi has demonstrated MagnaChip's capability of providing truly leading edge BCD processes to support our customers' growth."

The Microsemi and MagnaChip advanced BCD process will improve time-to-market for new product development, while enabling the ongoing re-use of all proven low-voltage blocks and cells that Microsemi has adopted for existing products. Microsemi currently has five new products in the final stages of development using the new BCD process, four of which are now being tested and validated both internally and by customers. All five products have benefitted from the improved performance and cost associated with the enhanced BCD process.

About MagnaChip Semiconductor

Headquartered in South Korea, MagnaChip Semiconductor is a leading, Asia-based designer and manufacturer of analog and mixed-signal semiconductor products for high volume consumer
applications. The Company has a broad range of analog and mixed-signal semiconductor technology and intellectual property, supported by its 30-year operating history, large portfolio of registered and pending patents and extensive engineering and manufacturing process expertise. For more information, please visit www.magnachip.com.

About Microsemi

Microsemi Corporation, with corporate headquarters in Irvine, California, is a leading designer, manufacturer and marketer of high performance analog and mixed-signal integrated circuits and high reliability semiconductors. The company's semiconductors manage and control or regulate power, protect against transient voltage spikes and transmit, receive and amplify signals.

Microsemi's products include individual components as well as integrated circuit solutions that enhance customer designs by improving performance and
reliability, battery optimization, reducing size or protecting circuits. The principal markets the company serves include implanted medical, defense/aerospace and satellite, notebook computers, monitors and LCD TVs, automotive and mobile connectivity applications. More information may be obtained by contacting the company directly or by visiting its website at http://www.microsemi.com.

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"Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995: Any statements set forth in this news release that are not entirely historical and factual in nature, including without limitation statements concerning partnering with specialty foundry provider MagnaChip Semiconductor LLC to develop advanced mixed-signal process technology that is optimized for products in
Microsemi's key commercial growth markets, are forward-looking statements. These forward-looking statements are based on our current expectations and are inherently subject to risks and uncertainties that could cause actual results to differ materially from those expressed in the forward-looking statements. The potential risks and uncertainties include, but are not limited to, such factors as rapidly changing technology and product obsolescence, potential cost increases, variations in customer order preferences, weakness or competitive pricing environment of the marketplace, uncertain demand for and acceptance of the company's products, adverse circumstances in any of our end markets, results of in-process or planned development or marketing and promotional campaigns, difficulties foreseeing future demand, potential non-realization of expected orders or non-realization of backlog,
product returns, product liability, and other potential unexpected business and economic conditions or adverse changes in current or expected industry conditions, difficulties and costs of protecting patents and other proprietary rights, inventory obsolescence and difficulties regarding customer qualification of products. In addition to these factors and any other factors mentioned elsewhere in this news release, the reader should refer as well to the factors, uncertainties or risks identified in the company's most recent Form 10-K and all subsequent Form 10-Q reports filed by Microsemi with the SEC. Additional risk factors may be identified from time to time in Microsemi's future filings. The forward-looking statements included in this release speak only as of the date hereof, and Microsemi does not undertake any obligation to update these forward-looking statements to reflect
subsequent events or circumstances.

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SOURCE: Microsemi Corporation

CONTACT:  Microsemi Corporation
Financial Contact:
John Hohener, Vice President and CFO
(949) 221-7100
Editorial Contact:
Cliff Silver, Corporate Communications Manager
(949) 221-7100

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