--   Breakthrough Package Size Enables Highest-Frequency Diodes
--   Patent-Pending Process Allows Automated Assembly

In an industry first, Microsemi Corp. (Nasdaq:MSCC - news) announced
today the commercial release of seven new semiconductor devices of a
near-microscopic size that allows them to handle broadband
frequencies.

The devices, developed by the Microsemi Microwave Division in
Lowell, Mass., are the first surface mount PIN and Varactor diodes
able to reach the 2-10 GHz frequencies used in wireless base stations
and in equipment used to test broadband components. Because the new
diode package is designed for automated tape-and-reel assembly, OEM
customers can lower manufacturing costs dramatically over their only
other option, conventional wire-bonded devices in costly metal
packages.

``Packaging technology enables us to add value in devices like
these new broadband semiconductors,'' said Philip Frey, Jr., Chairman,
Chief Executive Officer and President of Microsemi. ``It's a key
element in our strategy to serve the high-growth, high-volume
telecommunications market, including mobile phone and wireless
personal computing.''

``In this case, high-frequency devices require low parasitic
capacitance, which tends to mirror package size -- so small is good,''
he said. ``Using proprietary manufacturing techniques we can produce
finished Microsemi flip-chip devices that are so small you need a
microscope to see them. Their size greatly reduces capacitance that
all but prohibits the use of plastic packaging for broadband
semiconductors.''

At 0.020 x 0.040 x 0.015 inches, Microsemi's new broadband
semiconductors are the smallest in the industry. ``The company plans to
release even smaller devices by the end of the year,'' Frey added.

``High-frequency applications are proliferating,'' said Manuel
Lynch, Microsemi's Worldwide Marketing Director. ``In the next three
years, we're expecting a wide range of devices, including WAP and
IMT2000 G3 mobile phones, PDAs, and even household appliances to be
tied into wireless broadband communication networks. People will be
able to access enormous amounts of data and even control their homes
and offices from fully portable devices communicating at broadband
frequency,'' he said.

Lynch points to the formation of the Bluetooth Consortium, which
seeks to establish universal specifications for a fully-compatible
wireless environment, as a strong reflection of the growing demand for
wireless communication. Consortium founders included Intel
(Nasdaq:INTC - news), Nokia (NYSE:NOK - news), Ericsson, Toshiba and IBM (NYSE:IBM - news).

Handheld devices -- which already have created a $3.9 billion
world-wide market for radio frequency (RF) semiconductor devices in
mobile phones alone -- are forecast to become a $7.7 billion market by
2004, according to Strategies Unlimited.

While the new Microsemi devices are optimized for personal
communications systems (PCS) bands at 1.9-2.4 GHz, they also are
usable through the entire X band (up to 12.6 GHz) that's used in
applications such as radar and microwave towers. The company indicated
that most of its line of microwave semiconductors can be packaged
using the advanced technology that Microsemi calls ``Monolithic
Microwave Surface Mount'' (MMSM).

In the MMSM manufacturing process, patent-pending metallization
and etching techniques are used to create semiconductor devices that
are packaged during the fabrication of the wafer itself.
Interconnections are made by precise photo-lithographic techniques
that do not require wire bonds. The result is to reduce the device's
physical size, minimizing parasitic capacitance and providing
remarkable reproducibility across a wafer and over many wafers, all at
reasonable costs.

Five of the new Microsemi devices are PIN diodes with electrical
characteristics designed for high-power, high-speed, high-isolation
microwave switching, magnetic resonance imaging or amplifier
protection applications. The other two are Varactor diodes for low
voltage or wide-bandwidth voltage control oscillator (VCO) tuning
applications.

The new series is in full production, with OEM unit pricing in
quantities of 10,000 anticipated to be less than $3.00 each. Complete
specifications for all seven devices, numbered MPP4201/2/3/4, MPL4700
MPV1965 and MPV2100 can be found on the company's Web site at
www.microsemi.com.

About Microsemi Corp.

Microsemi is a global supplier of power management, RF/Microwave,
transient suppression and power conditioning semiconductor devices. It
serves the satellite, telecommunications, computer and peripherals,
medical, industrial/commercial and military/aerospace markets with
high reliability and commercial analog integrated circuits and power
and signal discrete semiconductors. More information may be obtained
by contacting the company directly or by visiting its Web site at
http://www.microsemi.com.

``Safe Harbor'' Statement under the Private Securities Litigation
Reform Act of 1995: Any statements set forth in the news release that
are not historical in nature are forward-looking statements.
Forward-looking statements are inherently subject to risks and
uncertainties, some of which cannot be predicted or quantified.
Potential risks and uncertainties include, but are not limited to,
such factors as the difficulties regarding the making of estimates and
projections, the hiring of qualified technical personnel in a
competitive labor market, rapidly changing technology and product
obsolescence, the ability to realize cost savings or productivity
gains, potential cost increases, the strength and competitive pricing
environment of the marketplace, demand for and acceptance of the
company's products, the success of planned development, marketing and
promotional campaigns, changes in demand for products, difficulties of
foreseeing future demand, potential non-realization of backlog,
business and economic conditions such as the current industry
conditions, customer order preferences, company strategies,
environmental matters, litigation, and inventory obsolescence. In
addition to these and any other factors mentioned elsewhere in this
news release, you should refer as well to the factors identified in
the company's most recent Form 10-K and subsequent Forms 10-Q filed by
the company with the Securities and Exchange Commission.

     Microsemi Corp.
     David R. Sonksen, 714/979-8220
        or
     Coffin Communications
     Sean Collins/William F. Coffin, 818/789-0100