In the challenge to meet the RoHS guidelines and to understand the impact while simultaneously assuring our Military and Aerospace customers that reliability will not compromised, it is necessary to first separate the Military Product lines from the Commercial Products lines and from the Industrial Product lines which are derived from Military Products.
Military Products, Tin-Lead Terminal Finish
Semiconductor products manufactured for the US Government and its various defense contractors have specific guidelines pertaining to terminal and case finish. The use of pure tin is forbidden at this time for Military products and we currently supply a Sn10Pb finish. Therefore, it is not yet possible to buy Military Products from Microsemi Lawrence that are RoHS compliant if that finish currently calls for the use of tin-lead alloy. Typically, the JAN, JANTX, JANTXV, and JANS prefix identifies these. Customers that require RoHS commercial versions of product from these lines employing Sn10Pb finish can specify such product by amending the part number by adding the suffix “e3” on the purchase order. For example, 1N5819 becomes 1N5819e3. This JESD97 code signifies a pure tin finish which, in this case, will be matte tin electroplate. Due to package size restrictions, the “e3” may be missing from the package itself bt it will be documented in the paperwork. Microsemi will continue to support all our Military customers and supply tin-lead surface finish on these products until the Military requests and authorizes a change.
Military Products, Gold Terminal Finish
Military components with gold plated finishes are already RoHS compliant. Since many customers request having these lead finishes hot solder dipped, it may be necessary to assure RoHS compliance by specifically asking that no hot solder dip be used. This would address previous inventory that may already have a tin-lead solder dip. This is the only flexibility afforded to us by the Defense Supply Center in Columbus, Ohio (DSCC). No product can be shipped with any JAN or DSCC designation unless complaint fully to government specifications.
Customers that require RoHS commercial versions of products from these lines employing a gold finish can specify such a product by amending the part number by adding the suffix “e4” on the purchase order. For example, 2N2222A becomes 2N2222Ae4. This JESD97 code signifies a noble metal finish which, in this case, would be gold electroplate. Due to package size restrictions, the “e4” may be missing from the package itself but it will be documented in the paperwork. Microsemi will continue to support all our Military customers and supply hot solder dip surface finish on these products until the Military requests and authorizes a change.
Commercial Products
Pure tin is allowed and is, in fact, being embraced by most commercial suppliers. To this end, Microsemi will be supplying 100% pure matte tin plate including a 150°C 1hr anneal to fully stabilize the finish. Most of our true commercial products are already converted or are being quickly converted to matte tin finish at our other divisions. Lawrence has very little product in this commercial category at the moment but that will change as our commercial lines expand. These parts would be designated with the “e3” suffix using the same restrictions previously mentioned.
Industrial Products
This category applies to commercial product that are derived from or otherwise take from Military Product lines. These may already have been plated to comply with Military Product requirements and, thus, contain some lead in the finish. For these products, Microsemi is free from any Military restrictions to strip the old lead-bearing finish and replace it with the 100% matte tin finish. A minimum order would be required due to capacity requirements of the various plating and stripping equipment. These parts would be designated with the “e3” suffix using the same restrictions previously mentioned.
Chip Products
All chip sales, whether Military, Commercial, or Industrial are naturally RoHS compliant. Typically backside metallization is either silver or gold and the front metallization is either silver or aluminum. The chips are made of silicon. This description covers virtually all the chips made in the Microsemi Lawrence Division. There are no part number changes required nor provided.